CPUs

HiSilicon Kirin 970 vs Qualcomm Snapdragon 6 Gen 4 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.36GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.3GHz
TDP
5W
TDP
5W
Bandwidth
29.9GB/s
LPDDR4X
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
429.7 GFLOPSFP16
··
1.07 TFLOPSFP16

Kirin 970Kirin 970380
x1
Snapdragon 6 Gen 4Snapdragon 6 Gen 4-
-

8 Cores
4P
-
4E
8 Cores
1P
3M
4E
8 Threads
4P
-
4E
8 Threads
1P
3M
4E

Base Clock
2.36GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
16KB E
L1i
64KB P
64KB M
32KB E
L1d
32KB P
-
16KB E
L1d
64KB P
64KB M
32KB E
L2
256KB P
-
128KB E
L2
512KB P
512KB M
128KB E

Type
LPDDR4X
Type
·
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
3733MT/s
Speed
6400MT/s
Bandwidth
29.9GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
144
Shaders
256
Boost Clock
746MHz
Boost Clock
1.05GHz
··
429.7 GFLOPSFP16
··
1.07 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon

Modem Model
HS LTE 18
Modem Model
X63S
Cellular
LTE
Cellular
5G mmWave
Peak Down
Up to 1.2Gbps
Peak Down
Up to 2.9Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 6 Gen 4  branding
Codename
Cortex-A73P-Core
-
Cortex-A53E-Core
Codename
Cortex-A720P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2017
Release Date
Feb 12, 2025

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
N6

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