CPUs

HiSilicon Kirin 970 vs Qualcomm Snapdragon 8 Elite Galaxy Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.36GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
4.47GHz
TDP
5W
TDP
5W
Bandwidth
29.9GB/s
LPDDR4X
Bandwidth
84.8GB/s
LPDDR5X
iGPU
iGPU
··
429.7 GFLOPSFP16
··
6.76 TFLOPSFP16

Kirin 970Kirin 970380
x1
Snapdragon 8 Elite GalaxySnapdragon 8 Elite Galaxy3,220
x8.47

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
2.36GHz
Base Clock
4.47GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
128KB P
64KB E
L1d
32KB P
16KB E
L1d
64KB P
64KB E
L2
256KB P
128KB E
-
-
L2
12MB P shared
12MB E shared
SLC Cache
-
SLC Cache
8MB

Type
LPDDR4X
Type
LPDDR5X
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
3733MT/s
Speed
10600MT/s
Bandwidth
29.9GB/s
Bandwidth
84.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
84.8GB/s

TDP
5W
TDP
5W
Peak Power
-
Peak Power
17W

iGPU
iGPU
Shaders
144
Shaders
1536
Boost Clock
746MHz
Boost Clock
1.1GHz
··
429.7 GFLOPSFP16
··
6.76 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon
Performance
-
Performance
45 TOPSINT8

Modem Model
HS LTE 18
Modem Model
X80
Cellular
LTE
Cellular
5G mmWave
Peak Down
Up to 1.2Gbps
Peak Down
Up to 10.0Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Oryon 2ARMv8.7-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 8 Elite  branding
Codename
-
Cortex-A73P-Core
Cortex-A53E-Core
Codename
Snapdragon 8 EliteVariant
Phoenix-PP-Core
Phoenix-EE-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2017
Release Date
Oct 21, 2024

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
N3E
Die Size
-
Die Size
124mm²

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