HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 460 Full Specs
8 Cores(2P+2M+4E) 8 Threads(2P+2M+4E) 2.86GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 1.8GHz |
TDP 5W | TDP 5W |
Bandwidth 34.1GB/s LPDDR4X | Bandwidth 14.9GB/s · |
iGPU | iGPU |
·· 921.6 GFLOPSFP16 | ·· 486.4 GFLOPSFP16 |
8 Cores 2P 2M 4E | 8 Cores 4P - 4E |
8 Threads 2P 2M 4E | 8 Threads 4P - 4E |
Base Clock 2.86GHz | Base Clock 1.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 32KB P - 16KB E |
L1d 64KB P 64KB M 32KB E | L1d 32KB P - 16KB E |
L2 512KB P 256KB M 128KB E - - | L2 1MB P shared 1MB E shared |
Type LPDDR4X | Type · |
Max Memory - | Max Memory 8GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 4266MT/s | Speed 3733MT/s |
Bandwidth 34.1GB/s | Bandwidth 14.9GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 5W | TDP 5W |
iGPU | iGPU |
Shaders 384 | Shaders 128 |
Boost Clock 600MHz | Boost Clock 950MHz |
·· 921.6 GFLOPSFP16 | ·· 486.4 GFLOPSFP16 |
NPU Model - | NPU Model Hexagon 683 |
Modem Model Balong 765 | Modem Model X11 |
Peak Down Up to 1.6Gbps | Peak Down Up to 390Mbps |
Peak Up Up to 225Mbps | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture Kryo 240ARMv8.0-A |
Family - | Family |
Branding  | Branding  |
Codename Cortex-A76P-Core Cortex-A76M-Core Cortex-A55E-Core | Codename Cortex-A73P-Core - Cortex-A53E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Oct 1, 2019 | Release Date Jan 20, 2020 |
Foundry - | Foundry Samsung |
Fabrication Node - | Fabrication Node 11LPP |
