IBM Cell Broadband Engine S vs IBM Corona Full Specs

Summary

8 Cores(1P+7E) 9 Threads(2P+7E) 3.2GHz	3 Cores 6 Threads 3.2GHz
TDP -	TDP 120W
Bandwidth 25.6GB/s XDR	Bandwidth -
iGPU -	iGPU Xenos E
Peak·FP32·FP16 -	Peak·FP32·FP16 240 GFLOPSFP32

Core Config

8 Cores 1P 7E	3 Cores 3P -
9 Threads 2P 7E	6 Threads 6P -

Clocks

Base Clock 3.2GHz	Base Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 512KB P 256KB E -	L2 1MB P shared

Memory

Type XDR	Type -
Max Memory 256MB	Max Memory -
ECC No	ECC -
Channels 4	Channels -
Bus Width 64-bit	Bus Width -
Speed 3200MT/s	Speed -
Bandwidth 25.6GB/s	Bandwidth -
Bandwidth Calculator Channels Transfer Rate3200MT/s UC·Spec·OC 25.6GB/s	Bandwidth Calculator -

Power & Thermals

TDP -

TDP 120W

Chipset Bus

Bus Type FSB	Bus Type FSB
Bus Config 128-bit	Bus Config 64-bit
Bus Speed 1.6GT/s	Bus Speed 1.35GT/s
Bus Bandwidth 25.6GB/s	Bus Bandwidth 10.8GB/s

iGPU

iGPU -	iGPU Xenos E
Shaders -	Shaders 240
Boost Clock -	Boost Clock 500MHz
Peak·FP32·FP16 -	Peak·FP32·FP16 240 GFLOPSFP32

Chip

Manufacturer IBM	Manufacturer IBM
ISA PowerPC	ISA PowerPC
Architecture Cell	Architecture Cell PPE
Branding	Branding
Codename Cell-S PPEP-Core SPEE-Core	Codename Corona WaternooseP-Core -
Market Segment Console	Market Segment Console
Release Date Oct 4, 2012	Release Date Jun 10, 2013

Fabrication

Foundry GlobalFoundries	Foundry GlobalFoundries
Fabrication Node 45nm	Fabrication Node 45nm
Die Size 115mm²	Die Size 168mm²
Transistor Count -	Transistor Count 372 Million
Transistor Density -	Transistor Density 2 MTr/mm²

Images

Used In

Game Consoles PS3 Super Slim

Game Consoles Xbox 360 E

Competitors

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