IBM Corona vs IBM Cell Broadband Engine S Full Specs

Summary

3 Cores 6 Threads 3.2GHz	8 Cores(1P+7E) 9 Threads(2P+7E) 3.2GHz
TDP 120W	TDP -
Bandwidth -	Bandwidth 25.6GB/s XDR
iGPU Xenos E	iGPU -
Peak·FP32·FP16 240 GFLOPSFP32	Peak·FP32·FP16 -

Core Config

3 Cores 3P -	8 Cores 1P 7E
6 Threads 6P -	9 Threads 2P 7E

Clocks

Base Clock 3.2GHz	Base Clock 3.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 32KB P	L1d 32KB P
L2 1MB P shared	L2 512KB P 256KB E -

Memory

Type -	Type XDR
Max Memory -	Max Memory 256MB
ECC -	ECC No
Channels -	Channels 4
Bus Width -	Bus Width 64-bit
Speed -	Speed 3200MT/s
Bandwidth -	Bandwidth 25.6GB/s
Bandwidth Calculator -	Bandwidth Calculator Channels Transfer Rate3200MT/s UC·Spec·OC 25.6GB/s

Power & Thermals

TDP 120W

TDP -

Chipset Bus

Bus Type FSB	Bus Type FSB
Bus Config 64-bit	Bus Config 128-bit
Bus Speed 1.35GT/s	Bus Speed 1.6GT/s
Bus Bandwidth 10.8GB/s	Bus Bandwidth 25.6GB/s

iGPU

iGPU Xenos E	iGPU -
Shaders 240	Shaders -
Boost Clock 500MHz	Boost Clock -
Peak·FP32·FP16 240 GFLOPSFP32	Peak·FP32·FP16 -

Chip

Manufacturer IBM	Manufacturer IBM
ISA PowerPC	ISA PowerPC
Architecture Cell PPE	Architecture Cell
Branding	Branding
Codename Corona WaternooseP-Core -	Codename Cell-S PPEP-Core SPEE-Core
Market Segment Console	Market Segment Console
Release Date Jun 10, 2013	Release Date Oct 4, 2012

Fabrication

Foundry GlobalFoundries	Foundry GlobalFoundries
Fabrication Node 45nm	Fabrication Node 45nm
Die Size 168mm²	Die Size 115mm²
Transistor Count 372 Million	Transistor Count -
Transistor Density 2 MTr/mm²	Transistor Density -

Images

Used In

Game Consoles Xbox 360 E

Game Consoles PS3 Super Slim

Competitors

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