CPUs

Intel Celeron 3867U vs AMD Ryzen 3 PRO 210 Full Specs

2 Cores
2 Threads
1.8GHz
4 Cores(1P+3E)
8 Threads(2P+6E)
3GHz
TDP
15W
TDP
28W
Bandwidth
34.1GB/s
··
Bandwidth
120GB/s
·
iGPU
iGPU
··
172.8 GFLOPSFP16
··
2.56 TFLOPSFP16
Socket
Socket

Celeron 3867UCeleron 3867U363
x1
Ryzen 3 PRO 210Ryzen 3 PRO 2102,100
x5.79

2 Cores
2P
-
4 Cores
1P
3E
2 Threads
2P
-
8 Threads
2P
6E

Base Clock
1.8GHz
Base Clock
3GHz
Boost Clock
-
Boost Clock
4.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
L1i
32KB P
L1d
32KB P
L1d
32KB P
L2
256KB P
L2
1MB P
L3
2MB
L3
8MB

Type
··
Type
·
Max Memory
32GB
Max Memory
256GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
2133MT/s
Speed
7500MT/s
Bandwidth
34.1GB/s
Bandwidth
120GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s

TDP
15W
TDP
28W
cTDP-down
13W
cTDP-down
15W
cTDP-up
-
cTDP-up
30W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max

Bus Type
OPI
Bus Type
PCIe
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
4GT/s
Bus Speed
16GT/s
Bus Bandwidth
2GB/s
Bus Bandwidth
8GB/s

PCIe
PCIe 3.0 x12
11.8GB/sBandwidth
PCIe
PCIe 4.0 x14
27.6GB/sBandwidth

iGPU
iGPU
Shaders
96
Shaders
256
Boost Clock
900MHz
Boost Clock
2.5GHz
··
172.8 GFLOPSFP16
··
2.56 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Pentium Gold 2017 branding
Branding
Ryzen 3 2024 branding
Codename
Kaby Lake-H
Kaby Lake-2C-GT2Variant
-
-
Codename
Hawk Point
Hawk Point SVariant
Zen 4P-Core
Zen 4cE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 1, 2019
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
14nm+
Fabrication Node
N4
Die Size
103mm²
Die Size
137mm²
Transistor Count
1.8 Billion
Transistor Count
20.9 Billion
Transistor Density
17 MTr/mm²
Transistor Density
153 MTr/mm²

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