CPUs

Intel Celeron 560 vs AMD Ryzen 7 PRO 250 Full Specs

1 Cores
1 Threads
2.13GHz
8 Cores
16 Threads
3.3GHz
TDP
31W
TDP
28W
Bandwidth
-
Bandwidth
120GB/s
·
iGPU
0
iGPU
··
-
··
8.29 TFLOPSFP16
Socket
Socket

Celeron 560Celeron 560234
x1
Ryzen 7 PRO 250Ryzen 7 PRO 2502,300
x9.83

1 Cores
8 Cores
1 Threads
16 Threads

Base Clock
2.13GHz
Base Clock
3.3GHz
Boost Clock
-
Boost Clock
5.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB shared
L2
1MB
L3
-
L3
16MB

Type
-
Type
·
Max Memory
-
Max Memory
256GB
ECC
-
ECC
No
Channels
-
Channels
2
Bus Width
-
Bus Width
128-bit
Speed
-
Speed
7500MT/s
Bandwidth
-
Bandwidth
120GB/s
Bandwidth Calculator
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s

TDP
31W
TDP
28W
cTDP-down
-
cTDP-down
15W
cTDP-up
-
cTDP-up
30W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Voltage Range
-
Voltage Range
-

Bus Type
FSB
Bus Type
PCIe
Bus Config
64-bit
Bus Config
4 lanes
Bus Speed
533MT/s
Bus Speed
16GT/s
Bus Bandwidth
4.3GB/s
Bus Bandwidth
8GB/s

-
PCIe
PCIe 4.0 x20
39.4GB/sBandwidth

iGPU
0
iGPU
Shaders
-
Shaders
768
Boost Clock
-
Boost Clock
2.7GHz
··
-
··
8.29 TFLOPSFP16

NPU Model
-
NPU Model
XDNA
Performance
-
Performance
16 TOPSINT4

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Celeron 2006 branding
Branding
Ryzen 7 2024 branding
Codename
Merom-L
Codename
Hawk Point
Market Segment
Laptop
Market Segment
Laptop
Release Date
Dec 1, 2007
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
65nm
Fabrication Node
N4
Die Size
77mm²
Die Size
178mm²
Transistor Count
105 Million
Transistor Count
25 Billion
Transistor Density
1 MTr/mm²
Transistor Density
140 MTr/mm²

No images available
No images available