CPUs

Intel Core 2 Extreme X7900 vs AMD Ryzen 3 210 Full Specs

2 Cores
2 Threads
2.8GHz
4 Cores(1P+3E)
8 Threads(2P+6E)
3GHz
TDP
44W
TDP
28W
Bandwidth
-
Bandwidth
120GB/s
·
iGPU
-
iGPU
··
-
··
2.56 TFLOPSFP16
Socket
Socket

Core 2 Extreme X7900Core 2 Extreme X7900331
x1
Ryzen 3 210Ryzen 3 2102,100
x6.34

2 Cores
2P
-
4 Cores
1P
3E
2 Threads
2P
-
8 Threads
2P
6E

Base Clock
2.8GHz
Base Clock
3GHz
Boost Clock
-
Boost Clock
4.7GHz
Overclocking
Unlocked
Overclocking
Locked

L1i
32KB P
L1i
32KB P
L1d
32KB P
L1d
32KB P
L2
4MB P shared
L2
1MB P
-
L3
-
L3
8MB

Type
-
Type
·
Max Memory
-
Max Memory
256GB
ECC
-
ECC
No
Channels
-
Channels
2
Bus Width
-
Bus Width
128-bit
Speed
-
Speed
7500MT/s
Bandwidth
-
Bandwidth
120GB/s
Bandwidth Calculator
-
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
120GB/s

TDP
44W
TDP
28W
cTDP-down
-
cTDP-down
15W
cTDP-up
-
cTDP-up
30W
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Voltage Range
-
Voltage Range
-

Bus Type
FSB
Bus Type
PCIe
Bus Config
64-bit
Bus Config
4 lanes
Bus Speed
800MT/s
Bus Speed
16GT/s
Bus Bandwidth
6.4GB/s
Bus Bandwidth
8GB/s

-
PCIe
PCIe 4.0 x14
27.6GB/sBandwidth

iGPU
-
iGPU
Shaders
-
Shaders
256
Boost Clock
-
Boost Clock
2.5GHz
··
-
··
2.56 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core 2 Extreme 2006 branding
Branding
Ryzen 3 2024 branding
Codename
Merom XE
-
-
-
Codename
Hawk Point
Hawk Point SVariant
Zen 4P-Core
Zen 4cE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Aug 1, 2007
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
65nm
Fabrication Node
N4
Die Size
143mm²
Die Size
137mm²
Transistor Count
291 Million
Transistor Count
20.9 Billion
Transistor Density
2 MTr/mm²
Transistor Density
153 MTr/mm²

No images available
No images available

All-in-Ones
All-in-Ones
-