CPUs

Intel Core i3-1005G1 vs Qualcomm Snapdragon 8 Gen 1 Full Specs

2 Cores
4 Threads
1.2GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
TDP
15W
TDP
5W
Bandwidth
59.7GB/s
·
Bandwidth
51.2GB/s
LPDDR5
iGPU
iGPU
··
921.6 GFLOPSFP16
··
3.35 TFLOPSFP16
Socket
Socket
-

Core i3-1005G11,304
x1
Snapdragon 8 Gen 1Snapdragon 8 Gen 11,311
x1.01

2 Cores
2P
-
-
8 Cores
1P
3M
4E
4 Threads
4P
-
-
8 Threads
1P
3M
4E

Base Clock
1.2GHz
Base Clock
3GHz
Boost Clock
3.4GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
-
L1i
64KB P
64KB M
32KB E
L1d
48KB P
-
-
L1d
64KB P
64KB M
32KB E
L2
512KB P
-
-
L2
1MB P
512KB M
128KB E
L3
4MB
L3
6MB
SLC Cache
-
SLC Cache
4MB

Type
·
Type
LPDDR5
Max Memory
32GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
128-bit
Bus Width
64-bit
Speed
3733MT/s
Speed
6400MT/s
Bandwidth
59.7GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
59.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
15W
TDP
5W
cTDP-down
13W
cTDP-down
-
cTDP-up
25W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
-

Bus Type
OPI
Bus Type
-
Bus Config
4 lanes
Bus Config
-
Bus Speed
4GT/s
Bus Speed
-
Bus Bandwidth
2GB/s
Bus Bandwidth
-

PCIe
PCIe 3.0 x8
7.9GB/sBandwidth
-

iGPU
iGPU
Shaders
256
Shaders
1024
Boost Clock
900MHz
Boost Clock
818MHz
··
921.6 GFLOPSFP16
··
3.35 TFLOPSFP16

NPU Model
GNA 1.0
NPU Model
Hexagon
Performance
-
Performance
52 TOPSINT4

Modem Model
-
Modem Model
X65
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 10.0Gbps
Peak Up
-
Peak Up
Up to 3.0Gbps

Controller Model
495 Series U+
Controller Model
-
Codename
Ice Lake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
Core i3 2019 branding
Branding
Snapdragon 8 Gen 1  branding
Codename
Ice Lake-U
-
Sunny CoveP-Core
-
-
Codename
-
Snapdragon 8 Gen 1Variant
Cortex-X2P-Core
Cortex-A710M-Core
Cortex-A510E-Core
Market Segment
Laptop
Market Segment
Smartphone
Release Date
Aug 1, 2019
Release Date
Oct 5, 2021

Foundry
Intel
Foundry
Samsung
Other Foundries
IntelPCH
Other Foundries
-
Fabrication Node
10nm+
14nmPCH
Fabrication Node
4LPE
-
Die Size
122mm²
54mm²PCH
Die Size
129mm²
-
Transistor Count
7 Billion
Transistor Count
-
Transistor Density
57 MTr/mm²
Transistor Density
-

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