CPUs

Intel Core i5-1235U vs Qualcomm Snapdragon 778G Full Specs

10 Cores(2P+8E)
12 Threads(4P+8E)
1.3GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.4GHz
TDP
15W
TDP
5W
Bandwidth
83.2GB/s
···
Bandwidth
25.6GB/s
LPDDR5
iGPU
iGPU
··
3.07 TFLOPSFP16
··
1.13 TFLOPSFP16
Socket
Socket
-

Core i5-1235UCore i5-1235U2,066
x2.17
Snapdragon 778G954
x1

10 Cores
2P
-
8E
8 Cores
1P
3M
4E
12 Threads
4P
-
8E
8 Threads
1P
3M
4E

Base Clock
1.3GHz
Base Clock
2.4GHz
Boost Clock
4.4GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
64KB E
L1i
64KB P
64KB M
32KB E
L1d
48KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
1.25MB P
-
-
2MB E shared
L2
512KB P
512KB M
128KB E
-
L3
12MB
L3
-
SLC Cache
-
SLC Cache
3MB

Type
···
Type
LPDDR5
Max Memory
64GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
32-bit
Speed
5200MT/s
Speed
6400MT/s
Bandwidth
83.2GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
83.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
15W
TDP
5W
Peak Power
55W
Peak Power
-
Max Operating Temp
100°C Max
Max Operating Temp
-

Bus Type
OPI
Bus Type
-
Bus Config
8 lanes
Bus Config
-
Bus Speed
4GT/s
Bus Speed
-
Bus Bandwidth
4GB/s
Bus Bandwidth
-

PCIe
PCIe 4.0 x12
23.6GB/sBandwidth
-

iGPU
iGPU
Shaders
640
Shaders
512
Boost Clock
1.2GHz
Boost Clock
550MHz
··
3.07 TFLOPSFP16
··
1.13 TFLOPSFP16

NPU Model
GNA 3.0
NPU Model
Hexagon 770
Performance
-
Performance
12 TOPS

Modem Model
-
Modem Model
X53
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 3.7Gbps
Peak Up
-
Peak Up
Up to 2.9Gbps

Controller Model
600 Series P+
Controller Model
-
Codename
Alder Lake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
Kryo 670ARMv8.2-A
Family
Family
Branding
Core i5 2020 branding
Branding
Snapdragon  branding
Codename
Alder Lake-P
Alder Lake-2P-8EVariant
Golden CoveP-Core
-
GracemontE-Core
Codename
-
-
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Market Segment
Laptop
Market Segment
Smartphone
Release Date
Feb 23, 2022
Release Date
May 19, 2021

Foundry
Intel
Foundry
TSMC
Other Foundries
IntelPCH
Other Foundries
-
Fabrication Node
Intel 7
14nmPCH
Fabrication Node
N6
-
Die Size
161mm²
54mm²PCH
Die Size
-
Transistor Count
11.9 Billion
Transistor Count
-
Transistor Density
74 MTr/mm²
Transistor Density
-

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