Intel Core i7-11850HE vs Intel Xeon W-11155MLE Full Specs

Summary

8 Cores 16 Threads 2.6GHz	4 Cores 8 Threads 1.8GHz
TDP 45W	TDP 25W
Bandwidth 51.2GB/s DDR4	Bandwidth 51.2GB/s DDR4
iGPU UHD 32EU 1350MHz Gen 12	iGPU UHD 16EU 1250MHz Gen 12
Peak·FP32·FP16 1.38 TFLOPSFP16	Peak·FP32·FP16 640 GFLOPSFP16
Socket BGA 1787	Socket BGA 1787

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i7-11850HE2,068

x1.38

Xeon W-11155MLE1,500

x1

Show Top Score

Core Config

8 Cores	4 Cores
16 Threads	8 Threads

Clocks

Base Clock 2.6GHz	Base Clock 1.8GHz
Boost Clock 4.7GHz	Boost Clock 3.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 48KB	L1d 48KB
L2 1.25MB	L2 1.25MB
L3 24MB	L3 8MB

Memory

Type DDR4	Type DDR4
Max Memory 64GB	Max Memory 128GB
ECC No	ECC Yes
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 3200MT/s	Speed 3200MT/s
Bandwidth 51.2GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

TDP 45W	TDP 25W
cTDP-down 35W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type DMI
Bus Config 8 lanes	Bus Config 8 lanes
Bus Speed 8GT/s	Bus Speed 8GT/s
Bus Bandwidth 8GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU UHD 32EU 1350MHz Gen 12	iGPU UHD 16EU 1250MHz Gen 12
Shaders 256	Shaders 128
Boost Clock 1.35GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 1.38 TFLOPSFP16	Peak·FP32·FP16 640 GFLOPSFP16

NPU

NPU Model GNA 2.0

NPU Model GNA 2.0

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Tiger Lake	Architecture Tiger Lake
Family Core 11th Gen	Family Core 11th Gen
Branding	Branding
Codename Tiger Lake-B Tiger Lake-8CVariant Willow CoveP-Core	Codename Tiger Lake-B Tiger Lake-8CVariant Willow CoveP-Core
Market Segment Embedded	Market Segment Embedded
Release Date Jun 22, 2021	Release Date May 11, 2021

Fabrication

Foundry Intel	Foundry Intel
Fabrication Node 10nm SuperFin	Fabrication Node 10nm SuperFin
Die Size 190mm²	Die Size 190mm²
Transistor Count 12.3 Billion	Transistor Count 12.3 Billion
Transistor Density 65 MTr/mm²	Transistor Density 65 MTr/mm²

Images

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