Intel Core i7-4960X vs Apple M3 Ultra (28C60G) Full Specs

Summary

6 Cores 12 Threads 3.6GHz	28 Cores(20P+8E) 28 Threads(20P+8E) 4.05GHz
TDP 130W	TDP 300W
Bandwidth 59.7GB/s DDR3	Bandwidth 819.2GB/s LPDDR5
iGPU 0	iGPU 60-Core M3 Ultra
Peak·FP32·FP16 -	Peak·FP32·FP16 21.2 TFLOPSFP16
Socket LGA 2011	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i7-4960X708

x1

M3 Ultra (28C60G)3,221

x4.55

Show Top Score

Core Config

6 Cores 6P -	28 Cores 20P 8E
12 Threads 12P -	28 Threads 20P 8E

Clocks

Base Clock 3.6GHz	Base Clock 4.05GHz
Boost Clock 4GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 256KB P - -	L2 64MB P shared 4MB E shared
L3 15MB	L3 -
SLC Cache -	SLC Cache 96MB

Memory

Type DDR3	Type LPDDR5
Max Memory 64GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 8
Bus Width 256-bit	Bus Width 1024-bit
Speed 1866MT/s	Speed 6400MT/s
Bandwidth 59.7GB/s	Bandwidth 819.2GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 819.2GB/s

Power & Thermals

TDP 130W	TDP 300W
Max Operating Temp -	Max Operating Temp 100°C Max
T-Case 66.8°C Max	T-Case -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 5GT/s	Bus Speed -
Bus Bandwidth 2.5GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x40 39.4GB/sBandwidth

PCIe PCIe 4.0 x32 63GB/sBandwidth

iGPU

iGPU 0	iGPU 60-Core M3 Ultra
Shaders -	Shaders 7680
Boost Clock -	Boost Clock 1.38GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 21.2 TFLOPSFP16

NPU

NPU Model -	NPU Model H15 Erebus
NPU Cores -	NPU Cores 32
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 36 TOPSFP16

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Ivy Bridge	Architecture Apple Silicon 13ARMv8.6-A
Family Core 4th Gen	Family M Series
Branding	Branding
Codename Ivy Bridge-E Ivy Bridge-EVariant - -	Codename Palma-D M3 UltraVariant EverestP-Core Sawtooth E-Core
Market Segment Workstation	Market Segment Workstation
Release Date Sep 1, 2013	Release Date Mar 5, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 22nm	Fabrication Node N3B
Die Size 257mm²	Die Size 954mm²
Transistor Count 1.9 Billion	Transistor Count 184 Billion
Transistor Density 7 MTr/mm²	Transistor Density 193 MTr/mm²

Images

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Used In

Desktops -

Desktops Mac Studio(M3 Ultra, Early 2025)

Competitors

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