CPUs

Intel Core i7-7600U vs AMD Ryzen 3 7335U Full Specs

2 Cores
4 Threads
2.8GHz
4 Cores
8 Threads
3GHz
TDP
15W
TDP
28W
Bandwidth
34.1GB/s
··
Bandwidth
102.4GB/s
·
iGPU
iGPU
··
441.6 GFLOPSFP16
··
2.77 TFLOPSFP16
Socket
Socket

2 Cores
4 Cores
4 Threads
8 Threads

Base Clock
2.8GHz
Base Clock
3GHz
Boost Clock
3.9GHz
Boost Clock
4.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
256KB
L2
512KB
L3
4MB
L3
8MB

Type
··
Type
·
Max Memory
32GB
Max Memory
64GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
2133MT/s
Speed
6400MT/s
Bandwidth
34.1GB/s
Bandwidth
102.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
102.4GB/s

TDP
15W
TDP
28W
cTDP-down
8W
cTDP-down
-
cTDP-up
25W
cTDP-up
-
Max Operating Temp
100°C Max
Max Operating Temp
95°C Max

Bus Type
OPI
Bus Type
PCIe
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
4GT/s
Bus Speed
8GT/s
Bus Bandwidth
2GB/s
Bus Bandwidth
4GB/s

PCIe
PCIe 3.0 x12
11.8GB/sBandwidth
PCIe
PCIe 4.0 x16
31.5GB/sBandwidth

iGPU
iGPU
Shaders
192
Shaders
384
Boost Clock
1.15GHz
Boost Clock
1.8GHz
··
441.6 GFLOPSFP16
··
2.77 TFLOPSFP16

Controller Model
200 Series U+
Controller Model
-
Codename
Kaby Lake
Codename
-
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core i7 2016 branding
Branding
Ryzen 3 2017 branding
Codename
Kaby Lake-H
Kaby Lake-2C-GT2Variant
Codename
Rembrandt-R
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 3, 2017
Release Date
Jan 4, 2023

Foundry
Intel
Foundry
TSMC
Other Foundries
IntelPCH
Other Foundries
-
Fabrication Node
14nm+
22nmPCH
Fabrication Node
N6
-
Die Size
103mm²
50mm²PCH
Die Size
210mm²
-
Transistor Count
1.8 Billion
Transistor Count
13.1 Billion
Transistor Density
17 MTr/mm²
Transistor Density
62 MTr/mm²