Intel Core i9-13950HX vs Apple M2 Max (12C30G) Full Specs

Summary

24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz	12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz
TDP 55W	TDP 140W
Bandwidth 89.6GB/s DDR5·DDR4	Bandwidth 409.6GB/s LPDDR5
iGPU UHD 32EU 1650MHz Gen 12	iGPU 30-Core M2 Max
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 10.74 TFLOPSFP16
Socket BGA 1964	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i9-13950HX2,680

x1

M2 Max (12C30G)2,825

x1.05

Show Top Score

Core Config

24 Cores 8P 16E	12 Cores 8P 4E
32 Threads 16P 16E	12 Threads 8P 4E

Clocks

Base Clock 2.2GHz	Base Clock 3.69GHz
Boost Clock 5.5GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 128KB P 64KB E
L2 2MB P - 16MB E shared	L2 24MB P shared 4MB E shared
L3 36MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type DDR5·DDR4	Type LPDDR5
Max Memory 128GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 512-bit
Speed 5600MT/s	Speed 6400MT/s
Bandwidth 89.6GB/s	Bandwidth 409.6GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 409.6GB/s

Power & Thermals

TDP 55W	TDP 140W
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 32EU 1650MHz Gen 12	iGPU 30-Core M2 Max
Shaders 256	Shaders 3840
Boost Clock 1.65GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 10.74 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model H14 Selene
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance -	Performance 15.8 TOPSFP16

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture Apple Silicon 11ARMv8.5-A
Family Core 13th Gen	Family M Series
Branding	Branding
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Rhodes-1C M2 MaxVariant AvalancheP-Core BlizzardE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jan 1, 2023	Release Date Jan 17, 2023

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N5P
Die Size 257mm²	Die Size 486mm²
Transistor Count 18.5 Billion	Transistor Count 67 Billion
Transistor Density 72 MTr/mm²	Transistor Density 138 MTr/mm²

Images

No images available

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Used In

Laptops Blade 16(Early 2023)	Laptops MacBook Pro 14(M2 Max, Early 2023)MacBook Pro 16(M2 Max, Early 2023)
Desktops -	Desktops Mac Studio(M2 Max, Mid 2023)

Competitors

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