Intel Core i9-13950HX vs Apple M3 Pro (12C18G) Full Specs
24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz | 12 Cores(6P+6E) 12 Threads(6P+6E) 4.05GHz |
TDP 55W | TDP 60W |
Bandwidth 89.6GB/s · | Bandwidth 153.6GB/s LPDDR5 |
iGPU | iGPU |
·· 1.69 TFLOPSFP16 | ·· 6.36 TFLOPSFP16 |
Socket | Socket - |
Core i9-13950HX2,680
M3 Pro (12C18G)3,14024 Cores 8P 16E | 12 Cores 6P 6E |
32 Threads 16P 16E | 12 Threads 6P 6E |
Base Clock 2.2GHz | Base Clock 4.05GHz |
Boost Clock 5.5GHz | Boost Clock - |
Overclocking Unlocked | Overclocking Locked |
L1i 32KB P 64KB E | L1i 192KB P 128KB E |
L1d 48KB P 32KB E | L1d 128KB P 64KB E |
L2 2MB P - 16MB E shared | L2 24MB P shared 4MB E shared |
L3 36MB | L3 - |
SLC Cache - | SLC Cache 12MB |
Type · | Type LPDDR5 |
Max Memory 128GB | Max Memory 36GB |
ECC No | ECC No |
Channels 2 | Channels 3 |
Bus Width 128-bit | Bus Width 192-bit |
Speed 5600MT/s | Speed 6400MT/s |
Bandwidth 89.6GB/s | Bandwidth 153.6GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 89.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 153.6GB/s |
TDP 55W | TDP 60W |
Peak Power 157W | Peak Power - |
Max Operating Temp 100°C Max | Max Operating Temp 100°C Max |
Bus Type DMI | Bus Type - |
Bus Config 8 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 16GB/s | Bus Bandwidth - |
PCIe PCIe 5.0 x1663GB/sBandwidth | PCIe PCIe 4.0 x815.8GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 256 | Shaders 2304 |
Boost Clock 1.65GHz | Boost Clock 1.38GHz |
·· 1.69 TFLOPSFP16 | ·· 6.36 TFLOPSFP16 |
NPU Model GNA 3.0 | NPU Model H15 Erebus |
NPU Cores - | NPU Cores 16 |
NPU Clock - | NPU Clock 2.36GHz |
Performance - | Performance 18 TOPSFP16 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Apple Silicon 13ARMv8.6-A |
Family | Family |
Branding  | Branding  |
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core | Codename Lobos M3 ProVariant EverestP-Core Sawtooth E-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 1, 2023 | Release Date Oct 30, 2023 |
Foundry Intel | Foundry TSMC |
Fabrication Node Intel 7 | Fabrication Node N3B |
Die Size 257mm² | Die Size 219mm² |
Transistor Count 18.5 Billion | Transistor Count 37 Billion |
Transistor Density 72 MTr/mm² | Transistor Density 169 MTr/mm² |
No images available
No images available