Intel Core m3-6Y30 vs Qualcomm Snapdragon 662 Full Specs

Summary

2 Cores 4 Threads 900MHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 4.5W	TDP 5W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 14.9GB/s LPDDR4X
iGPU HD 515 850MHz	iGPU Adreno 610
Peak·FP32·FP16 326.4 GFLOPSFP32	Peak·FP32·FP16 486.4 GFLOPSFP16
Socket BGA 1515	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core m3-6Y30710

x2.15

Snapdragon 662331

x1

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Core Config

2 Cores 2P -	8 Cores 4P 4E
4 Threads 4P -	8 Threads 4P 4E

Clocks

Base Clock 900MHz	Base Clock 2GHz
Boost Clock 2.2GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 16KB E
L1d 32KB P -	L1d 32KB P 16KB E
L2 256KB P - -	L2 2MB P shared 1MB E shared
L3 4MB	L3 -

Memory

Type LPDDR3·DDR3L	Type LPDDR4X
Max Memory 16GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 1866MT/s	Speed 3733MT/s
Bandwidth 29.9GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 4.5W	TDP 5W
cTDP-down 4W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 2GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

-

iGPU

iGPU HD 515 850MHz	iGPU Adreno 610
Shaders 192	Shaders 128
Boost Clock 850MHz	Boost Clock 950MHz
Peak·FP32·FP16 326.4 GFLOPSFP32	Peak·FP32·FP16 486.4 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon 683

Cellular

Modem Model -	Modem Model X11
Peak Down -	Peak Down Up to 390Mbps
Peak Up -	Peak Up Up to 150Mbps

Controller

Controller Model 100 Series Y+	Controller Model -
Codename Skylake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Skylake	Architecture Kryo 260ARMv8.0-A
Family Core 6th Gen	Family 6 Series
Branding	Branding
Codename Skylake-H Skylake-2C-GT2Variant - -	Codename - - Cortex-A73P-Core Cortex-A53E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Sep 1, 2015	Release Date Jan 20, 2020

Fabrication

Foundry Intel	Foundry Samsung
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 14nm 22nmPCH	Fabrication Node 14LPP -
Die Size 102mm² 50mm²PCH	Die Size -
Transistor Count 1.8 Billion	Transistor Count -
Transistor Density 17 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Tablets Surface Pro 4(Intel 6th Gen, Late 2015)

Tablets Galaxy Tab A7(SD 662, Late 2020)

Competitors

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