Intel Core m3-7Y30 vs Intel Core m3-7Y32 Full Specs

Summary

2 Cores 4 Threads 1GHz	2 Cores 4 Threads 1.1GHz
TDP 5W	TDP 5W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU HD 615 900MHz	iGPU HD 615 900MHz
Peak·FP32·FP16 345.6 GFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16
Socket BGA 1515	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core m3-7Y30777

x1.11

Core m3-7Y32700

x1

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Core Config

2 Cores	2 Cores
4 Threads	4 Threads

Clocks

Base Clock 1GHz	Base Clock 1.1GHz
Boost Clock 2.6GHz	Boost Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 256KB
L3 4MB	L3 4MB

Memory

Type LPDDR3·DDR3L	Type LPDDR3·DDR3L
Max Memory 16GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1866MT/s	Speed 1866MT/s
Bandwidth 29.9GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 5W
cTDP-down 4W	cTDP-down 4W
cTDP-up 7W	cTDP-up 7W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type OPI	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 4GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU HD 615 900MHz	iGPU HD 615 900MHz
Shaders 192	Shaders 192
Boost Clock 900MHz	Boost Clock 900MHz
Peak·FP32·FP16 345.6 GFLOPSFP16	Peak·FP32·FP16 345.6 GFLOPSFP16

Controller

Controller Model 200 Series Y+	Controller Model 200 Series Y+
Codename Kaby Lake	Codename Kaby Lake
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Skylake
Family Core 6th Gen	Family Core 6th Gen
Branding	Branding
Codename Kaby Lake-H Kaby Lake-2C-GT2Variant	Codename Kaby Lake-H Kaby Lake-2C-GT2Variant
Market Segment Laptop	Market Segment Laptop
Release Date Jan 3, 2017	Release Date Jan 3, 2017

Fabrication

Foundry Intel	Foundry Intel
Other Foundries IntelPCH	Other Foundries IntelPCH
Fabrication Node 14nm+ 22nmPCH	Fabrication Node 14nm+ 22nmPCH
Die Size 103mm² 50mm²PCH	Die Size 103mm² 50mm²PCH
Transistor Count 1.8 Billion	Transistor Count 1.8 Billion
Transistor Density 17 MTr/mm²	Transistor Density 17 MTr/mm²

Images

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Used In

Tablets Surface Pro 5(Intel 7th Gen, Mid 2017)

Tablets -

Competitors

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IntelCore m3-7Y32 vs CPU AMDRyzen 3 210 IntelCore m3-7Y32 vs CPU AMDRyzen 3 PRO 210 IntelCore m3-7Y32 vs CPU AMDRyzen 7 250 Show 12 more