Intel Core Ultra 5 125H vs Qualcomm Snapdragon X Elite (X1E-80-100) Full Specs

Summary

14 Cores(4P+8M+2E) 18 Threads(8P+8M+2E) 1.2GHz	12 Cores 12 Threads 3.4GHz
TDP 28W	TDP 80W
Bandwidth 119.5GB/s LPDDR5X·DDR5	Bandwidth 135.2GB/s LPDDR5X
iGPU Arc 7C 2200MHz	iGPU Adreno X1 3.8T
Peak·FP32·FP16 7.88 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16
Socket BGA 2049	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 125H2,275

x1

Snapdragon X Elite (X1E-80-100)2,797

x1.23

Show Top Score

Core Config

14 Cores 4P 8M 2E	12 Cores 12P - -
18 Threads 8P 8M 2E	12 Threads 12P - -

Clocks

Base Clock 1.2GHz	Base Clock 3.4GHz
Boost Clock 4.5GHz	Boost Clock 4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 64KB E	L1i 192KB P - -
L1d 48KB P 32KB M 32KB E	L1d 96KB P - -
L2 2MB P - 2MB M shared 2MB E shared	L2 36MB P shared - -
L3 18MB	L3 -
SLC Cache -	SLC Cache 6MB

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 96GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 7466MT/s	Speed 8448MT/s
Bandwidth 119.5GB/s	Bandwidth 135.2GB/s
Bandwidth Calculator Channels Transfer Rate7466MT/s Calculated Bandwidth 119.5GB/s	Bandwidth Calculator Channels Transfer Rate8448MT/s Calculated Bandwidth 135.2GB/s

Power & Thermals

TDP 28W	TDP 80W
cTDP-down 20W	cTDP-down -
cTDP-up 65W	cTDP-up -
Peak Power 115W	Peak Power -
Max Operating Temp 110°C Max	Max Operating Temp -

Expansion

PCIe PCIe 5.0 x8 31.5GB/sBandwidth	PCIe PCIe 4.0 x12 23.6GB/sBandwidth
PCIe Secondary PCIe 4.0 x20 39.4GB/sBandwidth	PCIe Secondary PCIe 3.0 x4 3.9GB/sBandwidth

iGPU

iGPU Arc 7C 2200MHz	iGPU Adreno X1 3.8T
Shaders 896	Shaders 1536
Boost Clock 2.2GHz	Boost Clock 1.25GHz
Peak·FP32·FP16 7.88 TFLOPSFP16	Peak·FP32·FP16 7.68 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model Hexagon
NPU Cores 2	NPU Cores -
NPU Clock 1.4GHz	NPU Clock -
Performance 11.5 TOPSINT8	Performance 45 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Meteor Lake	Architecture OryonARMv8.7-A
Family Core Ultra Series 1	Family X Series
Branding	Branding
Codename Meteor Lake-H Meteor Lake-P-6PVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core	Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core - -
Market Segment Laptop	Market Segment Laptop
Release Date Dec 14, 2023	Release Date Apr 24, 2024

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node Intel 4 N5iGPU N6IO N6SoC	Fabrication Node N4P - - -
Die Size 68mm² 44mm²iGPU 28mm²IO 100mm²SoC	Die Size 170mm² - - -
Transistor Count 10 Billion	Transistor Count -
Transistor Density 147 MTr/mm²	Transistor Density -

Images

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Used In

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Competitors

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