Intel Core Ultra 5 135U vs Qualcomm Snapdragon 720G Full Specs
12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 1.6GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 2.3GHz |
TDP 15W | TDP 5W |
Bandwidth 119.5GB/s · | Bandwidth 14.9GB/s LPDDR4X |
iGPU | iGPU |
·· 3.89 TFLOPSFP16 | ·· 844.8 GFLOPSFP16 |
Socket | Socket - |
12 Cores 2P 8M 2E | 8 Cores 2P - 6E |
14 Threads 4P 8M 2E | 8 Threads 2P - 6E |
Base Clock 1.6GHz | Base Clock 2.3GHz |
Boost Clock 4.4GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 64KB E | L1i 64KB P - 32KB E |
L1d 48KB P 32KB M 32KB E | L1d 64KB P - 32KB E |
L2 2MB P - 2MB M shared 2MB E shared | L2 512KB P 128KB E - - |
L3 12MB | L3 2MB |
SLC Cache - | SLC Cache 1MB |
Type · | Type LPDDR4X |
Max Memory 96GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 32-bit |
Speed 7466MT/s | Speed 3733MT/s |
Bandwidth 119.5GB/s | Bandwidth 14.9GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 14.9GB/s |
TDP 15W | TDP 5W |
cTDP-down 12W | cTDP-down - |
cTDP-up 28W | cTDP-up - |
Peak Power 57W | Peak Power - |
Max Operating Temp 110°C Max | Max Operating Temp - |
PCIe PCIe 4.0 x2039.4GB/sBandwidth | - |
iGPU | iGPU |
Shaders 512 | Shaders 256 |
Boost Clock 1.9GHz | Boost Clock 825MHz |
·· 3.89 TFLOPSFP16 | ·· 844.8 GFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model Hexagon 692 |
NPU Cores 2 | NPU Cores - |
NPU Clock 1.4GHz | NPU Clock - |
Performance 11.5 TOPSINT8 | Performance - |
Modem Model - | Modem Model X15 |
Peak Down - | Peak Down Up to 800Mbps |
Peak Up - | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Kryo 465ARMv8.2-A |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Meteor Lake-U Meteor Lake-P-2PVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core | Codename - - Cortex-A76P-Core - Cortex-A55E-Core |
Market Segment Laptop | Market Segment Smartphone |
Release Date Dec 14, 2023 | Release Date Jan 20, 2020 |
Foundry Intel | Foundry Samsung |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries - |
Fabrication Node Intel 4 N5iGPU N6IO N6SoC | Fabrication Node 8LPP - - - |
Die Size 38mm² 23mm²iGPU 28mm²IO 100mm²SoC | Die Size - |
Transistor Count 5.5 Billion | Transistor Count - |
Transistor Density 147 MTr/mm² | Transistor Density - |
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