CPUs

Intel Core Ultra 5 135U vs Qualcomm Snapdragon 8 Gen 3 Full Specs

12 Cores(2P+8M+2E)
14 Threads(4P+8M+2E)
1.6GHz
8 Cores(1P+5M+2E)
8 Threads(1P+5M+2E)
3.3GHz
TDP
15W
TDP
5W
Bandwidth
119.5GB/s
·
Bandwidth
76.8GB/s
LPDDR5X
iGPU
iGPU
··
3.89 TFLOPSFP16
··
5.53 TFLOPSFP16
Socket
Socket
-

Core Ultra 5 135UCore Ultra 5 135U2,135
x1.00
Snapdragon 8 Gen 32,128
x1

12 Cores
2P
8M
2E
8 Cores
1P
5M
2E
14 Threads
4P
8M
2E
8 Threads
1P
5M
2E

Base Clock
1.6GHz
Base Clock
3.3GHz
Boost Clock
4.4GHz
Boost Clock
-
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
64KB E
L1i
64KB P
64KB M
32KB E
L1d
48KB P
32KB M
32KB E
L1d
64KB P
64KB M
32KB E
L2
2MB P
-
-
2MB M shared
2MB E shared
L2
1MB P
512KB M
128KB E
-
-
L3
12MB
L3
12MB
SLC Cache
-
SLC Cache
4MB

Type
·
Type
LPDDR5X
Max Memory
96GB
Max Memory
24GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
128-bit
Bus Width
64-bit
Speed
7466MT/s
Speed
9600MT/s
Bandwidth
119.5GB/s
Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
119.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s

TDP
15W
TDP
5W
cTDP-down
12W
cTDP-down
-
cTDP-up
28W
cTDP-up
-
Peak Power
57W
Peak Power
-
Max Operating Temp
110°C Max
Max Operating Temp
-

PCIe
PCIe 4.0 x20
39.4GB/sBandwidth
-

iGPU
iGPU
Shaders
512
Shaders
1536
Boost Clock
1.9GHz
Boost Clock
900MHz
··
3.89 TFLOPSFP16
··
5.53 TFLOPSFP16

NPU Model
AI Boost 3
NPU Model
Hexagon
NPU Cores
2
NPU Cores
-
NPU Clock
1.4GHz
NPU Clock
-
Performance
11.5 TOPSINT8
Performance
45 TOPSINT8

Modem Model
-
Modem Model
X75
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 10.0Gbps
Peak Up
-
Peak Up
Up to 3.5Gbps

Manufacturer
Manufacturer
ISA
x86-64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
Core Ultra 5 2023 branding
Branding
Snapdragon 8 Gen 3  branding
Codename
Meteor Lake-U
Meteor Lake-P-2PVariant
Redwood CoveP-Core
CrestmontM-Core
CrestmontE-Core
Codename
-
Snapdragon 8 Gen 3Variant
Cortex-X4P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Laptop
Market Segment
Smartphone
Release Date
Dec 14, 2023
Release Date
Oct 24, 2023

Foundry
Intel
Foundry
TSMC
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Other Foundries
-
Fabrication Node
Intel 4
N5iGPU
N6IO
N6SoC
Fabrication Node
N4P
-
-
-
Die Size
38mm²
23mm²iGPU
28mm²IO
100mm²SoC
Die Size
137mm²
-
-
-
Transistor Count
5.5 Billion
Transistor Count
-
Transistor Density
147 MTr/mm²
Transistor Density
-

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