Intel Core Ultra 5 226V vs Apple M2 Max (12C30G) Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz	12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz
TDP 17W	TDP 140W
Bandwidth 136.5GB/s LPDDR5X	Bandwidth 409.6GB/s LPDDR5
iGPU Arc 130V 1850MHz	iGPU 30-Core M2 Max
Peak·FP32·FP16 106.1 TFLOPSFP16	Peak·FP32·FP16 10.74 TFLOPSFP16
Socket BGA 2833	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 226V2,543

x1

M2 Max (12C30G)2,825

x1.11

Show Top Score

Core Config

8 Cores 4P 4E	12 Cores 8P 4E
8 Threads 4P 4E	12 Threads 8P 4E

Clocks

Base Clock 4.5GHz	Base Clock 3.69GHz
Overclocking Locked	Overclocking Locked

Cache

L0i 64KB	L0i -
L0d 48KB	L0d -
L1i - 64KB E	L1i 192KB P 128KB E
L1d 192KB P 32KB E	L1d 128KB P 64KB E
L2 2.5MB P - 4MB E shared	L2 24MB P shared 4MB E shared
L3 8MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type LPDDR5X	Type LPDDR5
Max Memory 16GB	Max Memory 64GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 512-bit
Speed 8533MT/s	Speed 6400MT/s
Bandwidth 136.5GB/s	Bandwidth 409.6GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 136.5GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 409.6GB/s

Power & Thermals

TDP 17W	TDP 140W
cTDP-down 8W	cTDP-down -
Peak Power 37W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Expansion

PCIe PCIe 5.0 x4 15.8GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Arc 130V 1850MHz	iGPU 30-Core M2 Max
Shaders 896	Shaders 3840
Boost Clock 1.85GHz	Boost Clock 1.4GHz
Peak·FP32·FP16 106.1 TFLOPSFP16	Peak·FP32·FP16 10.74 TFLOPSFP16

NPU

NPU Model AI Boost 4	NPU Model H14 Selene
NPU Cores 5	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance 40 TOPSINT8	Performance 15.8 TOPSFP16

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Lunar Lake	Architecture Apple Silicon 11ARMv8.5-A
Family Core Ultra Series 2	Family M Series
Branding	Branding
Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core	Codename Rhodes-1C - M2 MaxVariant AvalancheP-Core BlizzardE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Sep 3, 2024	Release Date Jan 17, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries IntelFIB TSMCIO	Other Foundries -
Fabrication Node N3B 22nmFIB N6IO	Fabrication Node N5P - -
Die Size 140mm² 46mm²IO	Die Size 486mm² -
Transistor Count -	Transistor Count 67 Billion
Transistor Density -	Transistor Density 138 MTr/mm²

Images

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Used In

Laptops XPS 13(9350, Late 2024)Galaxy Book5 Pro 14(Early 2025)Galaxy Book5 Pro 16(Early 2025) Show 1 more	Laptops MacBook Pro 14(M2 Max, Early 2023)MacBook Pro 16(M2 Max, Early 2023)
Desktops -	Desktops Mac Studio(M2 Max, Mid 2023)

Competitors

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AppleM2 Max (12C30G) vs CPU AppleM5 Max (18C32G) AppleM2 Max (12C30G) vs CPU AppleM5 Max (18C40G) AppleM2 Max (12C30G) vs CPU AppleM3 (8C9G-FL) Show 12 more