Intel Core Ultra 5 226V

Core Ultra 5 226V

Intel Core m3-6Y30A

Core m3-6Y30A

Intel Core Ultra 5 226V vs Intel Core m3-6Y30A Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.1GHz
2 Cores
4 Threads
1.1GHz
TDP
17W
TDP
4.5W
Bandwidth
136.5GB/s
LPDDR5X
Bandwidth
29.9GB/s
·
iGPU
iGPU
··
106.1 TOPSINT4 Tensor
··
326.4 GFLOPSFP32
Socket
Socket

Core Ultra 5 226VCore Ultra 5 226V
x3.21
Core m3-6Y30ACore m3-6Y30A
x1

8 Cores
4P
4E
2 Cores
2P
-
8 Threads
4P
4E
4 Threads
4P
-

Base Clock
2.1GHz
Base Clock
1.1GHz
Boost Clock
4.5GHz
Boost Clock
2.2GHz
Overclocking
Locked
Overclocking
Locked

L0i
64KB
L0i
-
L0d
48KB
L0d
-
L1i
-
64KB E
L1i
32KB P
-
L1d
192KB P
32KB E
L1d
32KB P
-
L2
2.5MB P
4MB E shared
L2
256KB P
-
L3
8MB
L3
4MB

Type
LPDDR5X
Type
·
Max Memory
16GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
8533MT/s
Speed
1866MT/s
Bandwidth
136.5GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
136.5GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
29.9GB/s

TDP
17W
TDP
4.5W
cTDP-down
8W
cTDP-down
4W
Peak Power
37W
Peak Power
-
Max Operating Temp
100°C Max
Max Operating Temp
100°C Max
Included Cooler
-
Included Cooler
0

Bus Type
-
Bus Type
OPI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
4GT/s
Bus Bandwidth
-
Bus Bandwidth
2GB/s

PCIe
PCIe 5.0 x4
15.8GB/sBandwidth
PCIe
PCIe 3.0 x10
9.8GB/sBandwidth
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth
-

iGPU
iGPU
Shaders
896
Shaders
192
Boost Clock
1.85GHz
Boost Clock
850MHz
··
106.1 TOPSINT4 Tensor
··
326.4 GFLOPSFP32

NPU Model
AI Boost 4
NPU Model
-
NPU Cores
5
NPU Cores
-
Performance
40 TOPSINT8
Performance
-

Controller Model
-
Controller Model
100 Series Y+
Codename
-
Codename
Skylake
PCIe
-
PCIe
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core Ultra 5 2023 branding
Branding
Core m3 2015 branding
Codename
Lunar Lake-V
Lunar Lake-MXVariant
Lion CoveP-Core
SkymontE-Core
Codename
Skylake-Y
Skylake-2C-GT2Variant
-
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 3, 2024
Release Date
Sep 1, 2015
Part Number
QQ8076606107, QQ8076606108
Part Number
HE8066201930521
S-Spec
SRPMQ, SRPMR
S-Spec
SR2EN (D1)

Foundry
TSMC
Foundry
Intel
Other Foundries
IntelFIB
TSMCIO
-
Other Foundries
-
-
IntelPCH
Fabrication Node
N3B
22nmFIB
N6IO
-
Fabrication Node
14nm
-
-
22nmPCH
Die Size
140mm²
46mm²IO
-
Die Size
102mm²
-
50mm²PCH
Transistor Count
-
Transistor Count
1.8B
Transistor Density
-
Transistor Density
17 MTr/mm²