Intel Core Ultra 5 226V vs Qualcomm Snapdragon 8cx Gen 1 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 2.84GHz |
TDP 17W | TDP - |
Bandwidth 136.5GB/s LPDDR5X | Bandwidth 68.3GB/s LPDDR4X |
iGPU | iGPU |
·· 106.1 TFLOPSFP16 | ·· 3.69 TFLOPSFP16 |
Socket | Socket - |
Core Ultra 5 226V2,543
Snapdragon 8cx Gen 1-8 Cores 4P 4E | 8 Cores 4P 4E |
8 Threads 4P 4E | 8 Threads 4P 4E |
Base Clock 4.5GHz | Base Clock 2.84GHz |
Overclocking Locked | Overclocking Locked |
L0i 64KB | L0i - |
L0d 48KB | L0d - |
L1i - 64KB E | L1i 64KB P 32KB E |
L1d 192KB P 32KB E | L1d 64KB P 32KB E |
L2 2.5MB P - 4MB E shared | L2 512KB P 128KB E - |
L3 8MB | L3 2MB |
SLC Cache - | SLC Cache 3MB |
Type LPDDR5X | Type LPDDR4X |
Max Memory 16GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 8 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 8533MT/s | Speed 4266MT/s |
Bandwidth 136.5GB/s | Bandwidth 68.3GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 136.5GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 68.3GB/s |
TDP 17W | TDP - |
cTDP-down 8W | cTDP-down - |
Peak Power 37W | Peak Power - |
Max Operating Temp 100°C Max | Max Operating Temp - |
PCIe PCIe 5.0 x415.8GB/sBandwidth | - |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 896 | Shaders 1536 |
Boost Clock 1.85GHz | Boost Clock 600MHz |
·· 106.1 TFLOPSFP16 | ·· 3.69 TFLOPSFP16 |
NPU Model AI Boost 4 | NPU Model Hexagon 690 |
NPU Cores 5 | NPU Cores - |
Performance 40 TOPSINT8 | Performance 9 TOPS |
Modem Model - | Modem Model X55 |
Cellular - | Cellular 5G mmWave |
Peak Down - | Peak Down Up to 7.5Gbps |
Peak Up - | Peak Up Up to 3.0Gbps |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Kryo 495ARMv8.2-A |
Family | Family |
Branding  | Branding  |
Codename Lunar Lake-V 3Die Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core | Codename - - Snapdragon 8cx Gen 1Variant Cortex-A76P-Core Cortex-A55E-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Sep 3, 2024 | Release Date Jul 9, 2019 |
Foundry TSMC | Foundry TSMC |
Other Foundries IntelFIB TSMCIO | Other Foundries - |
Fabrication Node N3B 22nmFIB N6IO | Fabrication Node N7 - - |
Die Size 140mm² 46mm²IO | Die Size - |
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