Intel Core Ultra 7 265K vs AMD EPYC 7532 Full Specs

Summary

20 Cores(8P+12E) 20 Threads(8P+12E) 3.9GHz	32 Cores 64 Threads 2.4GHz
TDP 125W	TDP 200W
Bandwidth 102.4GB/s DDR5	Bandwidth 204.8GB/s DDR4
iGPU Graphics 4C 2000MHz	iGPU 0
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 -
Socket LGA 1851	Socket SP3

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 7 265K3,275

x2.75

EPYC 75321,190

x1

Show Top Score

Core Config

20 Cores 8P 12E	32 Cores 32P -
20 Threads 8P 12E	64 Threads 64P -

Clocks

Base Clock 3.9GHz	Base Clock 2.4GHz
Boost Clock 5.5GHz	Boost Clock 3.3GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P 64KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 32KB P -
L2 3MB P 12MB E shared	L2 512KB P -
L3 30MB	L3 256MB

Memory

Type DDR5	Type DDR4
Max Memory 192GB	Max Memory 4.1TB
ECC Yes	ECC Yes
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 512-bit
Speed 6400MT/s	Speed 3200MT/s
Bandwidth 102.4GB/s	Bandwidth 204.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate3200MT/s Calculated Bandwidth 204.8GB/s

Power & Thermals

TDP 125W	TDP 200W
Peak Power 250W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 8 lanes	Bus Config 8 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 16GB/s	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	PCIe PCIe 4.0 x128 252GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Graphics 4C 2000MHz	iGPU 0
Shaders 512	Shaders -
Boost Clock 2GHz	Boost Clock -
Peak·FP32·FP16 4.1 TFLOPSFP16	Peak·FP32·FP16 -

NPU

NPU Model AI Boost 3	NPU Model -
NPU Cores 2	NPU Cores -
Performance 13 TOPSINT8	Performance -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Arrow Lake	Architecture Zen 2
Family Core Ultra Series 2	Family EPYC 7002
Branding	Branding
Codename Arrow Lake-S - Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core	Codename Rome Aspen HighlandsDie Rome 8CCDVariant - -
Market Segment Desktop	Market Segment Server
Release Date Oct 24, 2024	Release Date Aug 7, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries - GlobalFoundriesIO -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N7 - 12LPIO -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size 592mm² - 416mm²IO -
Transistor Count -	Transistor Count 30.4 Billion 8.3 BillionIO
Transistor Density -	Transistor Density 51 MTr/mm² 20 MTr/mm²IO

Images

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Used In

Desktops OMEN 35L(Late 2024)OMEN 45L(Late 2024)

Desktops Tinybox Red(Mid 2024)Tinybox Green(Mid 2024)

Competitors

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