Intel Core Ultra 9 275HX vs Apple M4 Max (14C32G) Full Specs

Summary

24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz	14 Cores(10P+4E) 14 Threads(10P+4E) 4.51GHz
TDP 55W	TDP 140W
Bandwidth 102.4GB/s DDR5	Bandwidth 409.6GB/s LPDDR5X
iGPU Graphics 4C 1900MHz	iGPU 32-Core M4 Max
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 12.93 TFLOPSFP16
Socket BGA 2114	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 9 275HX3,044

x1

M4 Max (14C32G)3,990

x1.31

Show Top Score

Core Config

24 Cores 8P 16E	14 Cores 10P 4E
24 Threads 8P 16E	14 Threads 10P 4E

Clocks

Base Clock 2.7GHz	Base Clock 4.51GHz
Boost Clock 5.4GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 128KB P 64KB E
L2 3MB P - 16MB E shared	L2 32MB P shared 4MB E shared
L3 24MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type DDR5	Type LPDDR5X
Max Memory 192GB	Max Memory 96GB
ECC No	ECC No
Channels 2	Channels 3
Bus Width 128-bit	Bus Width 384-bit
Speed 6400MT/s	Speed 8533MT/s
Bandwidth 102.4GB/s	Bandwidth 409.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate8533MT/s Calculated Bandwidth 409.6GB/s

Power & Thermals

TDP 55W	TDP 140W
cTDP-down 45W	cTDP-down -
Peak Power 160W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Graphics 4C 1900MHz	iGPU 32-Core M4 Max
Shaders 512	Shaders 4096
Boost Clock 1.9GHz	Boost Clock 1.58GHz
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 12.93 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model H16 Aether
NPU Cores 2	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance 13 TOPSINT8	Performance 38 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture Apple Silicon 14ARMv9.2-A
Family Core Ultra Series 2	Family M Series
Branding	Branding
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core	Codename Brava M4 MaxVariant AS14PP-Core AS14EE-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jan 6, 2025	Release Date Oct 30, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N3E - - -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size 454mm² - - -
Transistor Count -	Transistor Count 76 Billion
Transistor Density -	Transistor Density 167 MTr/mm²

Images

No images available

No images available

Used In

Laptops Blade 18(Early 2025)	Laptops MacBook Pro 16(M4 Max, Late 2024)MacBook Pro 14(M4 Max, Late 2024)
Desktops -	Desktops Mac Studio(M4 Max, Early 2025)

Competitors

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AppleM4 Max (14C32G) vs CPU AppleM5 Max (18C32G) AppleM4 Max (14C32G) vs CPU AppleM5 Max (18C40G) AppleM4 Max (14C32G) vs CPU AppleM5 Pro (15C16G) Show 12 more