CPUs

Intel Pentium 2030M vs AMD Ryzen 5 5605GE Full Specs

2 Cores
2 Threads
2.5GHz
6 Cores
12 Threads
3.4GHz
TDP
35W
TDP
35W
Bandwidth
25.6GB/s
·
Bandwidth
51.2GB/s
DDR4
iGPU
iGPU
··
176 GFLOPSFP32
··
3.4 TFLOPSFP16
Socket
Socket

Pentium 2030MPentium 2030M428
x1
Ryzen 5 5605GERyzen 5 5605GE1,957
x4.57

2 Cores
6 Cores
2 Threads
12 Threads

Base Clock
2.5GHz
Base Clock
3.4GHz
Boost Clock
-
Boost Clock
4.4GHz
Overclocking
Locked
Overclocking
Unlocked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
256KB
L2
512KB
L3
2MB
L3
16MB

Type
·
Type
DDR4
Max Memory
32GB
Max Memory
64GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
1600MT/s
Speed
3200MT/s
Bandwidth
25.6GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
35W
TDP
35W
Max Operating Temp
90°C Max
Max Operating Temp
95°C Max

Bus Type
DMI
Bus Type
PCIe
Bus Config
4 lanes
Bus Config
4 lanes
Bus Speed
5GT/s
Bus Speed
8GT/s
Bus Bandwidth
2.5GB/s
Bus Bandwidth
4GB/s

PCIe
PCIe 2.0 x16
8GB/sBandwidth
PCIe
PCIe 3.0 x20
19.7GB/sBandwidth

iGPU
iGPU
Shaders
80
Shaders
448
Boost Clock
1.1GHz
Boost Clock
1.9GHz
··
176 GFLOPSFP32
··
3.4 TFLOPSFP16

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Pentium 2013 branding
Branding
Ryzen 5 2017 branding
Codename
Gladden
Ivy Bridge-M-2Die
Ivy Bridge-2C-GT1Variant
Codename
Cezanne
-
-
Market Segment
Laptop
Market Segment
Desktop
Release Date
Jan 1, 2013
Release Date
Feb 26, 2025

Foundry
Intel
Foundry
TSMC
Fabrication Node
22nm
Fabrication Node
N7
Die Size
94mm²
Die Size
180mm²
Transistor Count
750 Million
Transistor Count
10.7 Billion
Transistor Density
8 MTr/mm²
Transistor Density
59 MTr/mm²

No images available
No images available