Intel Pentium Gold 4415Y vs Qualcomm Snapdragon 720G Full Specs

Summary

2 Cores 4 Threads 1.6GHz	8 Cores(2P+6E) 8 Threads(2P+6E) 2.3GHz
TDP 6W	TDP 5W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 14.9GB/s LPDDR4X
iGPU HD 615 850MHz	iGPU Adreno 618
Peak·FP32·FP16 326.4 GFLOPSFP16	Peak·FP32·FP16 844.8 GFLOPSFP16
Socket BGA 1515	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Pentium Gold 4415Y360

x1

Snapdragon 720G738

x2.05

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Core Config

2 Cores 2P -	8 Cores 2P 6E
4 Threads 4P -	8 Threads 2P 6E

Clocks

Base Clock 1.6GHz	Base Clock 2.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 64KB P 32KB E
L1d 32KB P -	L1d 64KB P 32KB E
L2 256KB P -	L2 512KB P 128KB E
L3 2MB	L3 2MB
SLC Cache -	SLC Cache 1MB

Memory

Type LPDDR3·DDR3L	Type LPDDR4X
Max Memory 16GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 1866MT/s	Speed 3733MT/s
Bandwidth 29.9GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 6W	TDP 5W
cTDP-down 5W	cTDP-down -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 2GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

-

iGPU

iGPU HD 615 850MHz	iGPU Adreno 618
Shaders 192	Shaders 256
Boost Clock 850MHz	Boost Clock 825MHz
Peak·FP32·FP16 326.4 GFLOPSFP16	Peak·FP32·FP16 844.8 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon 692

Cellular

Modem Model -	Modem Model X15
Peak Down -	Peak Down Up to 800Mbps
Peak Up -	Peak Up Up to 150Mbps

Controller

Controller Model 200 Series Y+	Controller Model -
Codename Kaby Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Skylake	Architecture Kryo 465ARMv8.2-A
Family Pentium	Family 7 Series
Branding	Branding
Codename Kaby Lake-H Kaby Lake-2C-GT2Variant - -	Codename - - Cortex-A76P-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Jan 3, 2017	Release Date Jan 20, 2020

Fabrication

Foundry Intel	Foundry Samsung
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 14nm+ 22nmPCH	Fabrication Node 8LPP -
Die Size 103mm² 50mm²PCH	Die Size -
Transistor Count 1.8 Billion	Transistor Count -
Transistor Density 17 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets Surface Go(Kaby Lake, Mid 2018)

Tablets Galaxy Tab S6 Lite(SD 720G, Early 2022)

Competitors

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