Intel U302L vs Qualcomm Snapdragon 410E Full Specs

Summary

5 Cores(1P+4E) 6 Threads(2P+4E) 2.4GHz	4 Cores 4 Threads 1.2GHz
TDP 15W	TDP -
Bandwidth 83.2GB/s DDR5·DDR4	Bandwidth 4.3GB/s LPDDR2
iGPU Iris Xe 80EU 1100MHz	iGPU Adreno 306
Peak·FP32·FP16 2.82 TFLOPSFP16	Peak·FP32·FP16 43.2 GFLOPSFP16
Socket LGA 1700	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

U302L1,970

x1

Snapdragon 410E-

-

Show Top Score

Core Config

5 Cores 1P 4E	4 Cores 4P -
6 Threads 2P 4E	4 Threads 4P -

Clocks

Base Clock 2.4GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 32KB P -
L2 1.25MB P - 2MB E shared	L2 512KB P shared -
L3 10MB	L3 -

Memory

Type DDR5·DDR4	Type LPDDR2
Max Memory 96GB	Max Memory 4GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 32-bit
Speed 5200MT/s	Speed 1066MT/s
Bandwidth 83.2GB/s	Bandwidth 4.3GB/s
Bandwidth Calculator Channels Transfer Rate5200MT/s Calculated Bandwidth 83.2GB/s	Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 4.3GB/s

Power & Thermals

TDP 15W	TDP -
cTDP-down 12W	cTDP-down -
cTDP-up 28W	cTDP-up -
Peak Power 55W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Iris Xe 80EU 1100MHz	iGPU Adreno 306
Shaders 640	Shaders 24
Boost Clock 1.1GHz	Boost Clock 450MHz
Peak·FP32·FP16 2.82 TFLOPSFP16	Peak·FP32·FP16 43.2 GFLOPSFP16

NPU

NPU Model DL Boost	NPU Model Hexagon QDSP6 V5
NPU Clock -	NPU Clock 691MHz

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture ARMv8.0-A
Family Processor	Family 4 Series
Branding	Branding
Codename Raptor Lake-U Raptor Lake-2P-8EVariant Golden CoveP-Core GracemontE-Core	Codename - - Cortex-A53P-Core -
Market Segment Embedded	Market Segment Embedded
Release Date Apr 8, 2024	Release Date Sep 9, 2014

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 7	Fabrication Node 28nm LP
Die Size 161mm²	Die Size -
Transistor Count 11.9 Billion	Transistor Count -
Transistor Density 74 MTr/mm²	Transistor Density -

Images

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Competitors

IntelU302L vs CPU IntelU303L IntelU302L vs CPU IntelU301L IntelU302L vs CPU IntelU300L Show 12 more

QualcommSnapdragon 410E vs CPU IntelU303L QualcommSnapdragon 410E vs CPU IntelU301L QualcommSnapdragon 410E vs CPU IntelU300L