Intel Xeon E7-8895 v3 vs AMD EPYC 7352 Full Specs
18 Cores | 24 Cores |
36 Threads | 48 Threads |
Base Clock 2.6GHz | Base Clock 2.3GHz |
Boost Clock 3.5GHz | Boost Clock 3.2GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB | L1i 32KB |
L1d 32KB | L1d 32KB |
L2 256KB | L2 512KB |
L3 45MB | L3 128MB |
Type · | Type DDR4 |
Max Memory 1.54TB | Max Memory 4.1TB |
ECC Yes | ECC Yes |
Channels 4 | Channels 8 |
Bus Width 256-bit | Bus Width 512-bit |
Speed 1866MT/s | Speed 3200MT/s |
Bandwidth 59.7GB/s | Bandwidth 204.8GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
TDP 175W | TDP 155W |
Bus Type QPI | Bus Type PCIe |
Bus Config 16-bit | Bus Config 8 lanes |
Bus Speed 9.6GT/s | Bus Speed 16GT/s |
Bus Bandwidth 19.2GB/s | Bus Bandwidth 16GB/s |
PCIe PCIe 3.0 x3231.5GB/sBandwidth | PCIe PCIe 4.0 x128252GB/sBandwidth |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Haswell-EP - Haswell-E-HCCVariant | Codename Rome Aspen HighlandsDie Rome 4CCDVariant |
Market Segment Server | Market Segment Server |
Release Date May 6, 2015 | Release Date Aug 7, 2019 |
Foundry Intel | Foundry TSMC |
Other Foundries - | Other Foundries GlobalFoundriesIO |
Fabrication Node 22nm - | Fabrication Node N7 12LPIO |
Die Size 662mm² - | Die Size 296mm² 416mm²IO |
Transistor Count 5.7 Billion - | Transistor Count 15.2 Billion 8.3 BillionIO |
Transistor Density 9 MTr/mm² - | Transistor Density 51 MTr/mm² 20 MTr/mm²IO |
