Intel Xeon Gold 5317 vs AMD EPYC 7313P Full Specs

12 Cores
24 Threads
3GHz
16 Cores
32 Threads
3GHz
TDP
150W
TDP
155W
Bandwidth
187.7GB/s
DDR4
Bandwidth
204.8GB/s
DDR4
Socket
Socket

Xeon Gold 5317Xeon Gold 5317
x1
EPYC 7313PEPYC 7313P
x1.31

12 Cores
16 Cores
24 Threads
32 Threads

Base Clock
3GHz
Base Clock
3GHz
Boost Clock
3.6GHz
Boost Clock
3.7GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
48KB
L1d
32KB
L2
1.25MB
L2
512KB
L3
18MB
L3
128MB

Type
DDR4
Type
DDR4
Max Memory
6.14TB
Max Memory
4.1TB
ECC
Yes
ECC
Yes
Channels
8
Channels
8
Bus Width
512-bit
Bus Width
512-bit
Speed
2933MT/s
Speed
3200MT/s
Bandwidth
187.7GB/s
Bandwidth
204.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
187.7GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
204.8GB/s

TDP
150W
TDP
155W
cTDP-down
-
cTDP-down
155W
cTDP-up
-
cTDP-up
180W
T-Case
84°C Max
T-Case
-
Included Cooler
0
Included Cooler
-

Bus Type
UPI
Bus Type
PCIe
Bus Config
20-bit
Bus Config
8 lanes
Bus Speed
11.2GT/s
Bus Speed
16GT/s
Bus Bandwidth
28GB/s
Bus Bandwidth
16GB/s

PCIe
PCIe 4.0 x64
126GB/sBandwidth
PCIe
PCIe 4.0 x128
252GB/sBandwidth

NPU Model
DL Boost
NPU Model
-

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Xeon Gold 2020 branding
Branding
EPYC 2017 branding
Codename
Ice Lake-SP
-
Ice Lake-SP-LCCVariant
Sunny CoveP-Core
Codename
Milan
BreckenridgeDie
Milan 4CCDVariant
-
Market Segment
Server
Market Segment
Server
Release Date
Apr 6, 2021
Release Date
Mar 15, 2021

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
GlobalFoundriesIO
Fabrication Node
10nm+
-
Fabrication Node
N7
12LPIO
Die Size
360mm²
-
Die Size
323mm²
416mm²IO
Transistor Count
19.5B
-
Transistor Count
16.6B
8.3BIO
Transistor Density
54 MTr/mm²
-
Transistor Density
51 MTr/mm²
20 MTr/mm²IO