Intel Xeon Platinum 8356H

Xeon Platinum 8356H

AMD EPYC 72F3

EPYC 72F3

Intel Xeon Platinum 8356H vs AMD EPYC 72F3 Full Specs

8 Cores
16 Threads
3.9GHz
8 Cores
16 Threads
3.7GHz
TDP
190W
TDP
180W
Bandwidth
140.8GB/s
DDR4
Bandwidth
204.8GB/s
DDR4
Socket
Socket

Xeon Platinum 8356HXeon Platinum 8356H
x1
EPYC 72F3EPYC 72F3
x1.19

8 Cores
8 Cores
16 Threads
16 Threads

Base Clock
3.9GHz
Base Clock
3.7GHz
Boost Clock
4.4GHz
Boost Clock
4.1GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB
L1i
32KB
L1d
32KB
L1d
32KB
L2
1MB
L2
512KB
L3
35.8MB
L3
256MB

Type
DDR4
Type
DDR4
Max Memory
1.28TB
Max Memory
4.1TB
ECC
Yes
ECC
Yes
Channels
6
Channels
8
Bus Width
384-bit
Bus Width
512-bit
Speed
2933MT/s
Speed
3200MT/s
Bandwidth
140.8GB/s
Bandwidth
204.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
140.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
204.8GB/s

TDP
190W
TDP
180W
cTDP-down
-
cTDP-down
165W
cTDP-up
-
cTDP-up
200W
Included Cooler
0
Included Cooler
-

Bus Type
UPI
Bus Type
PCIe
Bus Config
16-bit
Bus Config
8 lanes
Bus Speed
10.4GT/s
Bus Speed
16GT/s
Bus Bandwidth
20.8GB/s
Bus Bandwidth
16GB/s

PCIe
PCIe 3.0 x48
47.3GB/sBandwidth
PCIe
PCIe 4.0 x128
252GB/sBandwidth

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Xeon Platinum 2020 branding
Branding
EPYC 2017 branding
Codename
Cooper Lake-SP
-
Cooper Lake-SP-XCCVariant
Codename
Milan
BreckenridgeDie
Milan 8CCDVariant
Market Segment
Server
Market Segment
Server
Release Date
Sep 1, 2020
Release Date
Mar 15, 2021

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
GlobalFoundriesIO
Fabrication Node
14nm+++
-
Fabrication Node
N7
12LPIO
Die Size
700mm²
-
Die Size
646mm²
416mm²IO
Transistor Count
12.3B
-
Transistor Count
33.2B
8.3BIO
Transistor Density
18 MTr/mm²
-
Transistor Density
51 MTr/mm²
20 MTr/mm²IO