CPUs

MediaTek Dimensity 7200 vs Qualcomm Snapdragon 888 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.8GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.84GHz
TDP
-
TDP
5W
Bandwidth
51.2GB/s
·
Bandwidth
51.2GB/s
LPDDR5
iGPU
iGPU
··
1.16 TFLOPSFP16
··
2.58 TFLOPSFP16

Dimensity 7200Dimensity 72001,187
x1.01
Snapdragon 888Snapdragon 8881,172
x1

8 Cores
2P
-
6E
8 Cores
1P
3M
4E
8 Threads
2P
-
6E
8 Threads
1P
3M
4E

Base Clock
2.8GHz
Base Clock
2.84GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
1MB P
-
128KB E
L2
1MB P
512KB M
128KB E
L3
4MB
L3
4MB
SLC Cache
-
SLC Cache
3MB

Type
·
Type
LPDDR5
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
6400MT/s
Bandwidth
51.2GB/s
Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
51.2GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
256
Shaders
768
Boost Clock
1.13GHz
Boost Clock
840MHz
··
1.16 TFLOPSFP16
··
2.58 TFLOPSFP16

NPU Model
MediaTek APU 650
NPU Model
Hexagon 780
Performance
-
Performance
26 TOPS

Modem Model
MT 5G R2
Modem Model
X60
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 4.7Gbps
Peak Down
Up to 7.5Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 3.0Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 680ARMv8.2-A
Family
Family
Branding
Dimensity 7200  branding
Branding
Snapdragon 888  branding
Codename
-
Cortex-A715P-Core
-
Cortex-A510E-Core
Codename
Snapdragon 888Variant
Cortex-X1P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2023
Release Date
Mar 25, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N4P
Fabrication Node
5LPE
Die Size
-
Die Size
112mm²
Transistor Count
-
Transistor Count
10 Billion
Transistor Density
-
Transistor Density
89 MTr/mm²

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