MediaTek Dimensity 9000 vs Qualcomm Snapdragon 8 Gen 3 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.05GHz	8 Cores(1P+5M+2E) 8 Threads(1P+5M+2E) 3.3GHz
TDP -	TDP 5W
Bandwidth 60GB/s LPDDR5X·LPDDR5	Bandwidth 76.8GB/s LPDDR5X
iGPU Mali-G710 MP10 848MHz	iGPU Adreno 750
Peak·FP32·FP16 2.17 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Dimensity 90001,298

x1

Snapdragon 8 Gen 32,128

x1.64

Show Top Score

Core Config

8 Cores 1P 3M 4E	8 Cores 1P 5M 2E
8 Threads 1P 3M 4E	8 Threads 1P 5M 2E

Clocks

Base Clock 3.05GHz	Base Clock 3.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P 64KB M 32KB E	L1d 64KB P 64KB M 32KB E
L2 1MB P 512KB M 128KB E	L2 1MB P 512KB M 128KB E
L3 8MB	L3 12MB
SLC Cache -	SLC Cache 4MB

Memory

Type LPDDR5X·LPDDR5	Type LPDDR5X
Max Memory -	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 7500MT/s	Speed 9600MT/s
Bandwidth 60GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 76.8GB/s

Power & Thermals

TDP -

TDP 5W

iGPU

iGPU Mali-G710 MP10 848MHz	iGPU Adreno 750
Shaders 640	Shaders 1536
Boost Clock 848MHz	Boost Clock 900MHz
Peak·FP32·FP16 2.17 TFLOPSFP16	Peak·FP32·FP16 5.53 TFLOPSFP16

NPU

NPU Model MediaTek APU 590	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Cellular

Modem Model MT 5G	Modem Model X75
Cellular 5G	Cellular 5G mmWave
Peak Down Up to 2.8Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 900Mbps	Peak Up Up to 3.5Gbps

Chip

Manufacturer MediaTek	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture ARMv9.0-A	Architecture KryoARMv9.0-A
Family Dimensity	Family 8 Series
Branding	Branding
Codename - Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core	Codename Snapdragon 8 Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 1, 2021	Release Date Oct 24, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N4P	Fabrication Node N4P
Die Size -	Die Size 137mm²

Images

No images available

No images available

Used In

Smartphones -	Smartphones OnePlus 12OnePlus 13R
Tablets OnePlus Pad(D9000, Early 2023)	Tablets OnePlus Pad 2(SD 8G3, Mid 2024)

Competitors

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