MediaTek Dimensity 9000 vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs
8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 3.05GHz | 10 Cores 10 Threads 3.4GHz |
TDP - | TDP 23W |
Bandwidth 60GB/s · | Bandwidth 135.2GB/s LPDDR5X |
iGPU | iGPU |
·· 2.17 TFLOPSFP16 | ·· 7.68 TFLOPSFP16 |
Dimensity 90001,298
Snapdragon X Plus (X1P-64-100)2,3498 Cores 1P 3M 4E | 10 Cores 10P - - |
8 Threads 1P 3M 4E | 10 Threads 10P - - |
Base Clock 3.05GHz | Base Clock 3.4GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 192KB P - - |
L1d 64KB P 64KB M 32KB E | L1d 96KB P - - |
L2 1MB P 512KB M 128KB E - | L2 36MB P shared |
L3 8MB | L3 - |
SLC Cache - | SLC Cache 6MB |
Type · | Type LPDDR5X |
Max Memory - | Max Memory 64GB |
ECC No | ECC No |
Channels 4 | Channels 8 |
Bus Width 64-bit | Bus Width 128-bit |
Speed 7500MT/s | Speed 8448MT/s |
Bandwidth 60GB/s | Bandwidth 135.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 60GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 135.2GB/s |
TDP - | TDP 23W |
- | PCIe PCIe 4.0 x1223.6GB/sBandwidth |
- | PCIe Secondary PCIe 3.0 x43.9GB/sBandwidth |
iGPU | iGPU |
Shaders 640 | Shaders 1536 |
Boost Clock 848MHz | Boost Clock 1.25GHz |
·· 2.17 TFLOPSFP16 | ·· 7.68 TFLOPSFP16 |
NPU Model MediaTek APU 590 | NPU Model Hexagon |
Performance - | Performance 45 TOPSINT8 |
Modem Model MT 5G | Modem Model - |
Cellular 5G | Cellular - |
Peak Down Up to 2.8Gbps | Peak Down - |
Peak Up Up to 900Mbps | Peak Up - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture | Architecture OryonARMv8.7-A |
Family | Family |
Branding  | Branding  |
Codename - - Cortex-X2P-Core Cortex-A710M-Core Cortex-A510E-Core | Codename Hamoa Snapdragon X EliteVariant PhoenixP-Core - - |
Market Segment Smartphone | Market Segment Laptop |
Release Date Oct 1, 2021 | Release Date Apr 24, 2024 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N4P | Fabrication Node N4P |
Die Size - | Die Size 170mm² |
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