CPUs

MediaTek Dimensity 9300 vs MediaTek Dimensity 6300 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
3.25GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.4GHz
Bandwidth
76.8GB/s
LPDDR5T
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
3.99 TFLOPSFP16
··
281.6 GFLOPSFP16

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
3.25GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
64KB P
32KB E
L1d
64KB P
32KB E
L1d
64KB P
32KB E
L2
1MB P
128KB E
L2
512KB P
128KB E
L3
8MB
L3
2MB

Type
LPDDR5T
Type
LPDDR4X
Max Memory
24GB
Max Memory
-
ECC
No
ECC
No
Channels
4
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
9600MT/s
Speed
4266MT/s
Bandwidth
76.8GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s

iGPU
iGPU
Shaders
768
Shaders
64
Boost Clock
1.3GHz
Boost Clock
1.1GHz
··
3.99 TFLOPSFP16
··
281.6 GFLOPSFP16

NPU Model
MediaTek APU 790
NPU Model
APU 3.0
NPU Cores
-
NPU Cores
3
Performance
-
Performance
2.4 TOPS

Modem Model
MT 5G mmWave R2
Modem Model
MT 5G
Cellular
5G mmWave
Cellular
5G
Peak Down
Up to 10.0Gbps
Peak Down
Up to 2.8Gbps
Peak Up
Up to 7.0Gbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
Dimensity 9300  branding
Branding
Dimensity  branding
Codename
Cortex-X4P-Core
Cortex-A720E-Core
Codename
Cortex-A76P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Nov 6, 2023
Release Date
Apr 1, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
N7
Die Size
140mm²
Die Size
-
Transistor Count
22.7 Billion
Transistor Count
-
Transistor Density
162 MTr/mm²
Transistor Density
-