MediaTek Dimensity 9500 vs MediaTek Dimensity 7350 Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 4.21GHz	8 Cores(2P+6E) 8 Threads(2P+6E) 3GHz
Bandwidth 85.3GB/s LPDDR5X	Bandwidth 51.2GB/s LPDDR5·LPDDR4X
iGPU Mali-G1 Ultra MP12 1716MHz	iGPU Mali-G610 MP4 1300MHz
Peak·FP32·FP16 10.54 TFLOPSFP16	Peak·FP32·FP16 1.33 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16

Dimensity 9500-

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Dimensity 73501,195

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Core Config

8 Cores 1P 3M 4E	8 Cores 2P - 6E
8 Threads 1P 3M 4E	8 Threads 2P - 6E

Clocks

Base Clock 4.21GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 64KB E	L1i 64KB P - 32KB E
L1d 128KB P 128KB M 64KB E	L1d 64KB P - 32KB E
L2 2MB P 1MB M 512KB E	L2 1MB P - 128KB E
L3 16MB	L3 4MB
SLC Cache 10MB	SLC Cache -

Memory

Type LPDDR5X	Type LPDDR5·LPDDR4X
Max Memory 24GB	Max Memory -
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 10667MT/s	Speed 6400MT/s
Bandwidth 85.3GB/s	Bandwidth 51.2GB/s
Bandwidth Calculator Channels Transfer Rate10667MT/s Calculated Bandwidth 85.3GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 51.2GB/s

Power & Thermals

Peak Power 18W

Peak Power -

iGPU

iGPU Mali-G1 Ultra MP12 1716MHz	iGPU Mali-G610 MP4 1300MHz
Shaders 1536	Shaders 256
Boost Clock 1.72GHz	Boost Clock 1.3GHz
Peak·FP32·FP16 10.54 TFLOPSFP16	Peak·FP32·FP16 1.33 TFLOPSFP16

NPU

NPU Model MediaTek NPU 990

NPU Model MediaTek APU 657

Cellular

Modem Model MT 5G mmWave R3	Modem Model MT 5G R2
Cellular 5G mmWave	Cellular 5G
Peak Down Up to 10.0Gbps	Peak Down Up to 4.7Gbps
Peak Up Up to 7.0Gbps	Peak Up Up to 900Mbps

Chip

Manufacturer MediaTek	Manufacturer MediaTek
ISA AArch64	ISA AArch64
Architecture ARMv9.3-A	Architecture ARMv9.0-A
Family Dimensity	Family Dimensity
Branding	Branding
Codename C1-UltraP-Core C1-PremiumM-Core C1-ProE-Core	Codename Cortex-A715P-Core - Cortex-A510E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Sep 22, 2025	Release Date Jul 1, 2024

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3P	Fabrication Node N4P
Die Size 141mm²	Die Size -
Transistor Count 30 Billion	Transistor Count -
Transistor Density 213 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Smartphones -

Smartphones Nothing Phone 2 Plus

Competitors

MediaTekDimensity 9500 vs CPU MediaTekDimensity 9400+ MediaTekDimensity 9500 vs CPU MediaTekDimensity 9400 MediaTekDimensity 9500 vs CPU MediaTekDimensity 7300 Show 12 more

MediaTekDimensity 7350 vs CPU MediaTekDimensity 9400 MediaTekDimensity 7350 vs CPU MediaTekDimensity 7300 MediaTekDimensity 7350 vs CPU MediaTekDimensity 9300+ Show 12 more