CPUs

MediaTek Helio G37 vs Qualcomm Snapdragon 4 Gen 2 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.3GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.2GHz
TDP
-
TDP
5W
Bandwidth
12.8GB/s
LPDDR4X
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
87.04 GFLOPSFP16
··
489 GFLOPSFP16

Helio G37Helio G37-
-
Snapdragon 4 Gen 2Snapdragon 4 Gen 2925
x1

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
2.3GHz
Base Clock
2.2GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
16KB E
L1i
64KB P
32KB E
L1d
16KB P
16KB E
L1d
64KB P
32KB E
L2
-
128KB E
1MB P shared
L2
512KB P
128KB E
-

Type
LPDDR4X
Type
·
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
32-bit
Speed
3200MT/s
Speed
6400MT/s
Bandwidth
12.8GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
32
Shaders
128
Boost Clock
680MHz
Boost Clock
955MHz
··
87.04 GFLOPSFP16
··
489 GFLOPSFP16

Modem Model
-
Modem Model
X61
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 2.5Gbps
Peak Up
-
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv8.2-A
Family
Family
Branding
Helio  branding
Branding
Snapdragon 4 Gen 2  branding
Codename
Cortex-A53P-Core
Cortex-A53E-Core
Codename
Cortex-A78P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2021
Release Date
Jun 1, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N6

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