CPUs

MediaTek Helio G37 vs Qualcomm Snapdragon 7s Gen 2 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.3GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.4GHz
Bandwidth
12.8GB/s
LPDDR4X
Bandwidth
25.6GB/s
LPDDR5
iGPU
iGPU
··
87.04 GFLOPSFP16
··
962.6 GFLOPSFP16

Helio G37Helio G37-
-
Snapdragon 7s Gen 2Snapdragon 7s Gen 21,011
x1

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2.3GHz
Base Clock
2.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
-
16KB E
L1i
64KB P
64KB M
32KB E
L1d
16KB P
-
16KB E
L1d
64KB P
64KB M
32KB E
L2
-
-
128KB E
1MB P shared
L2
512KB P
512KB M
128KB E
-
SLC Cache
-
SLC Cache
1MB

Type
LPDDR4X
Type
LPDDR5
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
32-bit
Speed
3200MT/s
Speed
6400MT/s
Bandwidth
12.8GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

iGPU
iGPU
Shaders
32
Shaders
256
Boost Clock
680MHz
Boost Clock
940MHz
··
87.04 GFLOPSFP16
··
962.6 GFLOPSFP16

NPU Model
-
NPU Model
Hexagon

Modem Model
-
Modem Model
X62
Cellular
-
Cellular
5G mmWave
Peak Down
-
Peak Down
Up to 4.4Gbps
Peak Up
-
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9.0-A
Family
Family
Branding
Helio  branding
Branding
Snapdragon 7s Gen 2  branding
Codename
Cortex-A53P-Core
Cortex-A53E-Core
Codename
Cortex-A78P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 1, 2021
Release Date
Sep 1, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N6

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