MediaTek Helio P22T vs Apple M3 (8C9G-FL) Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.3GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz
TDP 10W	TDP 15W
Bandwidth 9.6GB/s LPDDR4	Bandwidth 102.4GB/s LPDDR5
iGPU PowerVR GE8320 650MHz	iGPU 9-Core M3-FL
Peak·FP32·FP16 83.2 GFLOPSFP16	Peak·FP32·FP16 3.08 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Helio P22T-

-

M3 (8C9G-FL)3,130

x1

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 4P 4E
8 Threads 4P 4E	8 Threads 4P 4E

Clocks

Base Clock 2.3GHz	Base Clock 4.05GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB P 16KB E	L1i 192KB P 128KB E
L1d 16KB P 16KB E	L1d 128KB P 64KB E
L2 128KB E 1MB P shared -	L2 16MB P shared 4MB E shared
SLC Cache -	SLC Cache 8MB

Memory

Type LPDDR4	Type LPDDR5
Max Memory -	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 2400MT/s	Speed 6400MT/s
Bandwidth 9.6GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 9.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 10W	TDP 15W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU PowerVR GE8320 650MHz	iGPU 9-Core M3-FL
Shaders 32	Shaders 1152
Boost Clock 650MHz	Boost Clock 1.34GHz
Peak·FP32·FP16 83.2 GFLOPSFP16	Peak·FP32·FP16 3.08 TFLOPSFP16

NPU

NPU Model -	NPU Model H15 Themis
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 18 TOPSFP16

Cellular

Modem Model MT LTE 4	Modem Model -
Peak Down Up to 150Mbps	Peak Down -
Peak Up Up to 50Mbps	Peak Up -

Chip

Manufacturer MediaTek	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture Apple Silicon 13ARMv8.6-A
Family Helio	Family M Series
Branding	Branding
Codename - - Cortex-A53P-Core Cortex-A53E-Core	Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core
Market Segment Smartphone	Market Segment Tablet
Release Date Feb 1, 2018	Release Date Mar 4, 2025

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 28nm LP	Fabrication Node N3B
Die Size -	Die Size 153mm²
Transistor Count -	Transistor Count 25 Billion
Transistor Density -	Transistor Density 164 MTr/mm²

Images

No images available

No images available

Used In

Tablets Galaxy Tab A7 Lite(Helio P22T, Mid 2021)

Tablets iPad Air 11" Gen 2(M3, Early 2025)iPad Air 13" Gen 2(M3, Early 2025)

Competitors

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