MediaTek MT8173 vs Qualcomm Snapdragon 212 Full Specs

Summary

4 Cores(2P+2E) 4 Threads(2P+2E) 2GHz	4 Cores 4 Threads 1.3GHz
TDP -	TDP 5W
Bandwidth -	Bandwidth 4.3GB/s LPDDR2
iGPU PowerVR GX6250 700MHz	iGPU Adreno 304
Peak·FP32·FP16 179.2 GFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

Core Config

4 Cores 2P 2E	4 Cores 4P -
4 Threads 2P 2E	4 Threads 4P -

Clocks

Base Clock 2GHz	Base Clock 1.3GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 16KB E	L1i 16KB P -
L1d 32KB P 16KB E	L1d 16KB P -
L2 256KB P 128KB E -	L2 512KB P shared

Memory

Type -	Type LPDDR2
Max Memory -	Max Memory 4GB
ECC -	ECC No
Channels -	Channels 1
Bus Width -	Bus Width 32-bit
Speed -	Speed 1066MT/s
Bandwidth -	Bandwidth 4.3GB/s
Bandwidth Calculator -	Bandwidth Calculator Channels Transfer Rate1066MT/s UC·Spec·OC 4.3GB/s

Power & Thermals

TDP -

TDP 5W

iGPU

iGPU PowerVR GX6250 700MHz	iGPU Adreno 304
Shaders 64	Shaders 24
Boost Clock 700MHz	Boost Clock 400MHz
Peak·FP32·FP16 179.2 GFLOPSFP16	Peak·FP32·FP16 38.4 GFLOPSFP16

NPU

NPU Model -

NPU Model Hexagon 536

Cellular

Modem Model -	Modem Model X5
Peak Down -	Peak Down Up to 150Mbps
Peak Up -	Peak Up Up to 50Mbps

Chip

Manufacturer MediaTek	Manufacturer Qualcomm
ISA AArch64	ISA AArch32
Architecture ARMv8.0-A	Architecture ARMv7-A
Family -	Family 2 Series
Branding	Branding
Codename Cortex-A72P-Core Cortex-A53E-Core	Codename Cortex-A7P-Core -
Market Segment Smartphone	Market Segment Smartphone
Release Date Feb 1, 2015	Release Date Jul 1, 2015

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 45nm

Images

Competitors

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