NVIDIA AGX Orin 32GB vs Intel Core 3 100HL Full Specs
8 Cores 8 Threads 2.2GHz | 8 Cores(4P+4E) 12 Threads(8P+4E) 2.1GHz |
TDP 40W | TDP 45W |
Bandwidth 204.8GB/s LPDDR5 | Bandwidth 83.2GB/s · |
iGPU | iGPU |
·· 213.3 TFLOPSFP16 | ·· 2 TFLOPSFP16 |
Socket - | Socket |
AGX Orin 32GB-
Core 3 100HL2,4048 Cores 8P - | 8 Cores 4P 4E |
8 Threads 8P - | 12 Threads 8P 4E |
Base Clock 2.2GHz | Base Clock 2.1GHz |
Boost Clock - | Boost Clock 4.6GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P - | L1i 32KB P 64KB E |
L1d 64KB P - | L1d 48KB P 32KB E |
L2 256KB P - | L2 1.25MB P 2MB E shared |
L3 4MB | L3 12MB |
SLC Cache 4MB | SLC Cache - |
Type LPDDR5 | Type · |
Max Memory - | Max Memory 96GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 256-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 5200MT/s |
Bandwidth 204.8GB/s | Bandwidth 83.2GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 204.8GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 83.2GB/s |
TDP 40W | TDP 45W |
cTDP-down 15W | cTDP-down 35W |
cTDP-up - | cTDP-up 65W |
Peak Power - | Peak Power 115W |
Max Operating Temp - | Max Operating Temp 100°C Max |
Included Cooler - | Included Cooler 0 |
Bus Type - | Bus Type DMI |
Bus Config - | Bus Config 8 lanes |
Bus Speed - | Bus Speed 16GT/s |
Bus Bandwidth - | Bus Bandwidth 16GB/s |
- | PCIe PCIe 5.0 x1663GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth |
iGPU | iGPU |
Shaders 1792 | Shaders 384 |
Boost Clock 930MHz | Boost Clock 1.3GHz |
·· 213.3 TFLOPSFP16 | ·· 2 TFLOPSFP16 |
NPU Model NVDLA 2.0 | NPU Model DL Boost |
NPU Cores 2 | NPU Cores - |
NPU Clock 1.4GHz | NPU Clock - |
Performance 93.3 TOPSINT8 | Performance - |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture | Architecture |
Family - | Family |
Branding  | Branding  |
Codename Hercules - Cortex-A78AEP-Core - | Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core |
Market Segment Embedded | Market Segment Embedded |
Release Date Oct 1, 2022 | Release Date Jul 1, 2024 |
Foundry Samsung | Foundry Intel |
Fabrication Node 8N | Fabrication Node Intel 7 |
Die Size - | Die Size 208mm² |
Transistor Count 17 Billion | Transistor Count 15.2 Billion |
Transistor Density - | Transistor Density 73 MTr/mm² |
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