CPUs

Qualcomm Snapdragon 4 Gen 1 vs HiSilicon Kirin 9010 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2GHz
8 Cores(1P+3M+4E)
12 Threads(2P+6M+4E)
2.3GHz
TDP
5W
TDP
5W
Bandwidth
17.1GB/s
LPDDR4X
Bandwidth
67.2GB/s
LPDDR5X
iGPU
iGPU
··
972.8 GFLOPSFP16
··
3.07 TFLOPSFP16

Snapdragon 4 Gen 1Snapdragon 4 Gen 1-
-
Kirin 9010Kirin 90101,421
x1

8 Cores
2P
-
6E
8 Cores
1P
3M
4E
8 Threads
2P
-
6E
12 Threads
2P
6M
4E

Base Clock
2GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
-
128KB E
L2
512KB P
256KB M
128KB E

Type
LPDDR4X
Type
LPDDR5X
Max Memory
8GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
32-bit
Bus Width
64-bit
Speed
4266MT/s
Speed
8400MT/s
Bandwidth
17.1GB/s
Bandwidth
67.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
67.2GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
256
Shaders
1024
Boost Clock
950MHz
Boost Clock
750MHz
··
972.8 GFLOPSFP16
··
3.07 TFLOPSFP16

NPU Model
Hexagon
NPU Model
-

Modem Model
X51
Modem Model
Balong 5000
Cellular
5G mmWave
Cellular
5G
Peak Down
Up to 2.5Gbps
Peak Down
Up to 4.6Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 2.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
KryoARMv8.2-A
Architecture
TaishanARMv8.2-A
Family
Family
-
Branding
Snapdragon 4 Gen 1  branding
Branding
Kirin  branding
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Taishan V121P-Core
Taishan V121M-Core
Cortex-A510E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Oct 6, 2022
Release Date
Apr 1, 2024

Foundry
TSMC
Foundry
SMIC
Fabrication Node
N6
Fabrication Node
N+2

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