CPUs

Qualcomm Snapdragon 4 Gen 2 vs HiSilicon Kirin 9010 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.2GHz
8 Cores(1P+3M+4E)
12 Threads(2P+6M+4E)
2.3GHz
TDP
5W
TDP
5W
Bandwidth
25.6GB/s
·
Bandwidth
67.2GB/s
LPDDR5X
iGPU
iGPU
··
489 GFLOPSFP16
··
3.07 TFLOPSFP16

Snapdragon 4 Gen 2Snapdragon 4 Gen 2925
x1
Kirin 9010Kirin 90101,421
x1.54

8 Cores
2P
-
6E
8 Cores
1P
3M
4E
8 Threads
2P
-
6E
12 Threads
2P
6M
4E

Base Clock
2.2GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
-
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
-
128KB E
L2
512KB P
256KB M
128KB E

Type
·
Type
LPDDR5X
Max Memory
8GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
4
Bus Width
32-bit
Bus Width
64-bit
Speed
6400MT/s
Speed
8400MT/s
Bandwidth
25.6GB/s
Bandwidth
67.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
67.2GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
128
Shaders
1024
Boost Clock
955MHz
Boost Clock
750MHz
··
489 GFLOPSFP16
··
3.07 TFLOPSFP16

Modem Model
X61
Modem Model
Balong 5000
Cellular
5G mmWave
Cellular
5G
Peak Down
Up to 2.5Gbps
Peak Down
Up to 4.6Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 2.5Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
KryoARMv8.2-A
Architecture
TaishanARMv8.2-A
Family
Family
-
Branding
Snapdragon 4 Gen 2  branding
Branding
Kirin  branding
Codename
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Taishan V121P-Core
Taishan V121M-Core
Cortex-A510E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Jun 1, 2023
Release Date
Apr 1, 2024

Foundry
TSMC
Foundry
SMIC
Fabrication Node
N6
Fabrication Node
N+2

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