Qualcomm Snapdragon 412 vs Qualcomm Snapdragon 410 Full Specs

Summary

4 Cores 4 Threads 1.4GHz	4 Cores 4 Threads 1.2GHz
TDP 5W	TDP 5W
Bandwidth 4.8GB/s LPDDR2	Bandwidth 4.3GB/s LPDDR2
iGPU Adreno 306	iGPU Adreno 306
Peak·FP32·FP16 43.2 GFLOPSFP16	Peak·FP32·FP16 43.2 GFLOPSFP16

Core Config

4 Cores	4 Cores
4 Threads	4 Threads

Clocks

Base Clock 1.4GHz	Base Clock 1.2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 1MB shared	L2 1MB shared

Memory

Type LPDDR2	Type LPDDR2
Max Memory 4GB	Max Memory 4GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 32-bit
Speed 1200MT/s	Speed 1066MT/s
Bandwidth 4.8GB/s	Bandwidth 4.3GB/s
Bandwidth Calculator Channels Transfer Rate1200MT/s UC·Spec·OC 4.8GB/s	Bandwidth Calculator Channels Transfer Rate1066MT/s UC·Spec·OC 4.3GB/s

Power & Thermals

TDP 5W

TDP 5W

iGPU

iGPU Adreno 306	iGPU Adreno 306
Shaders 24	Shaders 24
Boost Clock 450MHz	Boost Clock 450MHz
Peak·FP32·FP16 43.2 GFLOPSFP16	Peak·FP32·FP16 43.2 GFLOPSFP16

NPU

NPU Model Hexagon QDSP6 V5

NPU Model Hexagon QDSP6 V5

Cellular

Modem Model X5	Modem Model -
Peak Down Up to 150Mbps	Peak Down -
Peak Up Up to 50Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture ARMv8.0-A	Architecture ARMv8.0-A
Family 4 Series	Family 4 Series
Branding	Branding
Codename Cortex-A53P-Core	Codename Cortex-A53P-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jul 1, 2015	Release Date Sep 9, 2014

Fabrication

Foundry Samsung	Foundry Samsung
Fabrication Node 28nm LP	Fabrication Node 28nm LP

Images

Competitors

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