Qualcomm Snapdragon 662 vs Apple A12 Bionic Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 2.49GHz
TDP 5W	TDP 5W
Bandwidth 14.9GB/s LPDDR4X	Bandwidth 34.1GB/s LPDDR4X
iGPU Adreno 610	iGPU 4-Core A12
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 562.2 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Snapdragon 662331

x1

A12 Bionic1,336

x4.04

Show Top Score

Core Config

8 Cores 4P 4E	6 Cores 2P 4E
8 Threads 4P 4E	6 Threads 2P 4E

Clocks

Base Clock 2GHz	Base Clock 2.49GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 16KB E	L1i 128KB P 48KB E
L1d 32KB P 16KB E	L1d 128KB P 32KB E
L2 2MB P shared 1MB E shared	L2 8MB P shared 2MB E shared
SLC Cache -	SLC Cache 8MB

Memory

Type LPDDR4X	Type LPDDR4X
Max Memory 8GB	Max Memory 4GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 3733MT/s	Speed 4266MT/s
Bandwidth 14.9GB/s	Bandwidth 34.1GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s Calculated Bandwidth 34.1GB/s

Power & Thermals

TDP 5W

TDP 5W

Expansion

-	PCIe PCIe 3.0 x5 4.9GB/sBandwidth

iGPU

iGPU Adreno 610	iGPU 4-Core A12
Shaders 128	Shaders 256
Boost Clock 950MHz	Boost Clock 1.1GHz
Peak·FP32·FP16 486.4 GFLOPSFP16	Peak·FP32·FP16 562.2 GFLOPSFP16

NPU

NPU Model Hexagon 683	NPU Model H11 Quin
NPU Cores -	NPU Cores 8
NPU Clock -	NPU Clock 1.26GHz
Performance -	Performance 5 TOPSFP16

Cellular

Modem Model X11	Modem Model -
Peak Down Up to 390Mbps	Peak Down -
Peak Up Up to 150Mbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 260ARMv8.0-A	Architecture Apple Silicon 8ARMv8.3-A
Family 6 Series	Family A Series
Branding	Branding
Codename - - Cortex-A73P-Core Cortex-A53E-Core	Codename Cyprus A12Variant VortexP-Core TempestE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Jan 20, 2020	Release Date Sep 21, 2018

Fabrication

Foundry Samsung	Foundry TSMC
Fabrication Node 14LPP	Fabrication Node N7
Die Size -	Die Size 83mm²
Transistor Count -	Transistor Count 6.9 Billion
Transistor Density -	Transistor Density 83 MTr/mm²

Images

No images available

No images available

Used In

Smartphones -	Smartphones iPhone XRiPhone XSiPhone XS Max
Tablets Galaxy Tab A7(SD 662, Late 2020)	Tablets iPad 8(A12, Late 2020)iPad Air 3(A12, Early 2019)iPad mini 5(A12, Early 2019)

Competitors

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