CPUs

Qualcomm Snapdragon 662 vs Apple M1 (8C8G-FL) Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
3.2GHz
TDP
5W
TDP
10W
Bandwidth
14.9GB/s
LPDDR4X
Bandwidth
68.3GB/s
LPDDR4X
iGPU
iGPU
··
486.4 GFLOPSFP16
··
2.62 TFLOPSFP16

Snapdragon 662Snapdragon 662331
x1
M1 (8C8G-FL)M1 (8C8G-FL)2,380
x7.19

8 Cores
4P
4E
8 Cores
4P
4E
8 Threads
4P
4E
8 Threads
4P
4E

Base Clock
2GHz
Base Clock
3.2GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
192KB P
128KB E
L1d
32KB P
16KB E
L1d
128KB P
64KB E
L2
2MB P shared
1MB E shared
L2
12MB P shared
4MB E shared
SLC Cache
-
SLC Cache
8MB

Type
LPDDR4X
Type
LPDDR4X
Max Memory
8GB
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
128-bit
Speed
3733MT/s
Speed
4266MT/s
Bandwidth
14.9GB/s
Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
14.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s

TDP
5W
TDP
10W
Max Operating Temp
-
Max Operating Temp
100°C Max

-
PCIe
PCIe 4.0 x5
9.8GB/sBandwidth

iGPU
iGPU
Shaders
128
Shaders
1024
Boost Clock
950MHz
Boost Clock
1.28GHz
··
486.4 GFLOPSFP16
··
2.62 TFLOPSFP16

NPU Model
Hexagon 683
NPU Model
H13 Styx
NPU Cores
-
NPU Cores
16
NPU Clock
-
NPU Clock
1.46GHz
Performance
-
Performance
11 TOPSFP16

Modem Model
X11
Modem Model
-
Peak Down
Up to 390Mbps
Peak Down
-
Peak Up
Up to 150Mbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Kryo 260ARMv8.0-A
Architecture
Family
Family
Branding
Snapdragon  branding
Branding
M1  branding
Codename
-
-
Cortex-A73P-Core
Cortex-A53E-Core
Codename
Tonga
M1Variant
FirestormP-Core
IcestormE-Core
Market Segment
Smartphone
Market Segment
Tablet
Release Date
Jan 20, 2020
Release Date
Nov 10, 2020

Foundry
Samsung
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
N5
Die Size
-
Die Size
123mm²
Transistor Count
-
Transistor Count
16 Billion
Transistor Density
-
Transistor Density
130 MTr/mm²

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