Qualcomm Snapdragon 7+ Gen 3 vs Qualcomm Snapdragon 778G+ Full Specs
8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 2.8GHz | 8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.5GHz |
TDP - | TDP 5W |
Bandwidth 67.2GB/s LPDDR5X | Bandwidth 25.6GB/s LPDDR5 |
iGPU | iGPU |
·· 2.92 TFLOPSFP16 | ·· 1.13 TFLOPSFP16 |
Snapdragon 7+ Gen 31,913
Snapdragon 778G+1,0088 Cores 1P 4M 3E | 8 Cores 1P 3M 4E |
8 Threads 1P 4M 3E | 8 Threads 1P 3M 4E |
Base Clock 2.8GHz | Base Clock 2.5GHz |
Overclocking Locked | Overclocking Locked |
L1i 64KB P 64KB M 32KB E | L1i 64KB P 64KB M 32KB E |
L1d 64KB P 64KB M 32KB E | L1d 64KB P 64KB M 32KB E |
L2 1MB P 512KB M 128KB E | L2 512KB P 512KB M 128KB E |
SLC Cache 1MB | SLC Cache 3MB |
Type LPDDR5X | Type LPDDR5 |
Max Memory 16GB | Max Memory 24GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 8400MT/s | Speed 6400MT/s |
Bandwidth 67.2GB/s | Bandwidth 25.6GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 25.6GB/s |
TDP - | TDP 5W |
iGPU | iGPU |
Shaders 768 | Shaders 512 |
Boost Clock 950MHz | Boost Clock 550MHz |
·· 2.92 TFLOPSFP16 | ·· 1.13 TFLOPSFP16 |
NPU Model Hexagon | NPU Model Hexagon 770 |
Performance - | Performance 12 TOPS |
Modem Model X63 | Modem Model X53 |
Cellular 5G mmWave | Cellular 5G mmWave |
Peak Down Up to 5.0Gbps | Peak Down Up to 3.7Gbps |
Peak Up Up to 1.6Gbps | Peak Up Up to 2.9Gbps |
Manufacturer | Manufacturer |
ISA AArch64 | ISA AArch64 |
Architecture KryoARMv9.2-A | Architecture Kryo 670ARMv8.2-A |
Family | Family |
Branding  | Branding  |
Codename Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core | Codename Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Aug 1, 2024 | Release Date Oct 5, 2021 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node N6 |
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