Qualcomm Snapdragon 778G vs Apple M2 (8C10G-FL) Full Specs

Summary

8 Cores(1P+3M+4E) 8 Threads(1P+3M+4E) 2.4GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 3.49GHz
TDP 5W	TDP 15W
Bandwidth 25.6GB/s LPDDR5	Bandwidth 102.4GB/s LPDDR5
iGPU Adreno 642L	iGPU 10-Core M2-FL
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 3.58 TFLOPSFP16

Core Config

8 Cores 1P 3M 4E	8 Cores 4P - 4E
8 Threads 1P 3M 4E	8 Threads 4P - 4E

Clocks

Base Clock 2.4GHz	Base Clock 3.49GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 32KB E	L1i 192KB P - 128KB E
L1d 64KB P 64KB M 32KB E	L1d 128KB P - 64KB E
L2 512KB P 512KB M 128KB E - -	L2 16MB P shared 4MB E shared
SLC Cache 3MB	SLC Cache 8MB

Memory

Type LPDDR5	Type LPDDR5
Max Memory 24GB	Max Memory 24GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 32-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 25.6GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 25.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s

Power & Thermals

TDP 5W	TDP 15W
Max Operating Temp -	Max Operating Temp 100°C Max

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Adreno 642L	iGPU 10-Core M2-FL
Shaders 512	Shaders 1280
Boost Clock 550MHz	Boost Clock 1.4GHz
Peak·FP32·FP16 1.13 TFLOPSFP16	Peak·FP32·FP16 3.58 TFLOPSFP16

NPU

NPU Model Hexagon 770	NPU Model H14 Bia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.1GHz
Performance 12 TOPS	Performance 15.8 TOPSFP16

Cellular

Modem Model X53	Modem Model -
Cellular 5G mmWave	Cellular -
Peak Down Up to 3.7Gbps	Peak Down -
Peak Up Up to 2.9Gbps	Peak Up -

Chip

Manufacturer Qualcomm	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Kryo 670ARMv8.2-A	Architecture Apple Silicon 11ARMv8.5-A
Family 7 Series	Family M Series
Branding	Branding
Codename - - Cortex-A78P-Core Cortex-A78M-Core Cortex-A55E-Core	Codename Staten M2Variant AvalancheP-Core - BlizzardE-Core
Market Segment Smartphone	Market Segment Tablet
Release Date May 19, 2021	Release Date Jun 6, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N5P
Die Size -	Die Size 153mm²
Transistor Count -	Transistor Count 20.1 Billion
Transistor Density -	Transistor Density 131 MTr/mm²

Images

Used In

Laptops -	Laptops MacBook Air 13(M2, Mid 2022)MacBook Air 15(M2, Mid 2023)
Smartphones Nothing Phone 1	Smartphones -
Tablets Galaxy Tab S7 FE(SD 778G, Mid 2021)	Tablets iPad Pro 11" Gen 4(M2, Early 2021)iPad Pro 12.9" Gen 6(M2, Early 2021)

Competitors

QualcommSnapdragon 778G vs CPU QualcommSnapdragon 778G+ QualcommSnapdragon 778G vs CPU QualcommSnapdragon 780G QualcommSnapdragon 778G vs CPU QualcommSnapdragon 750G Show 12 more

AppleM2 (8C10G-FL) vs CPU AppleM1 (8C7G-FL) AppleM2 (8C10G-FL) vs CPU AppleM1 (8C8G-FL) AppleM2 (8C10G-FL) vs CPU AppleM3 (8C8G-FL) Show 12 more