CPUs

Qualcomm Snapdragon 778G vs Qualcomm Snapdragon X Plus (X1P-64-100) Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.4GHz
10 Cores
10 Threads
3.4GHz
TDP
5W
TDP
23W
Bandwidth
25.6GB/s
LPDDR5
Bandwidth
135.2GB/s
LPDDR5X
iGPU
iGPU
··
1.13 TFLOPSFP16
··
7.68 TFLOPSFP16

Snapdragon 778GSnapdragon 778G954
x1
Snapdragon X Plus (X1P-64-100)Snapdragon X Plus (X1P-64-100)2,349
x2.46

8 Cores
1P
3M
4E
10 Cores
10P
-
-
8 Threads
1P
3M
4E
10 Threads
10P
-
-

Base Clock
2.4GHz
Base Clock
3.4GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
192KB P
-
-
L1d
64KB P
64KB M
32KB E
L1d
96KB P
-
-
L2
512KB P
512KB M
128KB E
-
L2
36MB P shared
SLC Cache
3MB
SLC Cache
6MB

Type
LPDDR5
Type
LPDDR5X
Max Memory
24GB
Max Memory
64GB
ECC
No
ECC
No
Channels
2
Channels
8
Bus Width
32-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
8448MT/s
Bandwidth
25.6GB/s
Bandwidth
135.2GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
135.2GB/s

TDP
5W
TDP
23W

-
PCIe
PCIe 4.0 x12
23.6GB/sBandwidth
-
PCIe Secondary
PCIe 3.0 x4
3.9GB/sBandwidth

iGPU
iGPU
Shaders
512
Shaders
1536
Boost Clock
550MHz
Boost Clock
1.25GHz
··
1.13 TFLOPSFP16
··
7.68 TFLOPSFP16

NPU Model
Hexagon 770
NPU Model
Hexagon
Performance
12 TOPS
Performance
45 TOPSINT8

Modem Model
X53
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 3.7Gbps
Peak Down
-
Peak Up
Up to 2.9Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Kryo 670ARMv8.2-A
Architecture
OryonARMv8.7-A
Family
Family
Branding
Snapdragon  branding
Branding
Snapdragon X Plus  branding
Codename
-
-
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Codename
Hamoa
Snapdragon X EliteVariant
PhoenixP-Core
-
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
May 19, 2021
Release Date
Apr 24, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N4P
Die Size
-
Die Size
170mm²

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