CPUs

Qualcomm Snapdragon 7c+ Gen 3 vs Intel Core Ultra 5 235UA Full Specs

12 Cores(8P+4E)
12 Threads(8P+4E)
2.55GHz
12 Cores(2P+8M+2E)
14 Threads(4P+8M+2E)
2GHz
TDP
-
TDP
15W
Bandwidth
25.6GB/s
·
Bandwidth
134.4GB/s
·
iGPU
iGPU
··
844.8 GFLOPSFP16
··
4.2 TFLOPSFP16
Socket
-
Socket

Snapdragon 7c+ Gen 3Snapdragon 7c+ Gen 3974
x1
Core Ultra 5 235UACore Ultra 5 235UA-
-

12 Cores
8P
-
4E
12 Cores
2P
8M
2E
12 Threads
8P
-
4E
14 Threads
4P
8M
2E

Base Clock
2.55GHz
Base Clock
2GHz
Boost Clock
-
Boost Clock
4.9GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
32KB E
L1i
64KB P
64KB M
64KB E
L1d
64KB P
-
32KB E
L1d
48KB P
32KB M
32KB E
L2
512KB P
128KB E
-
-
L2
3MB P
-
8MB M shared
8MB E shared
L3
-
L3
36MB

Type
·
Type
·
Max Memory
24GB
Max Memory
96GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
128-bit
Speed
6400MT/s
Speed
8400MT/s
Bandwidth
25.6GB/s
Bandwidth
134.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
134.4GB/s

TDP
-
TDP
15W
cTDP-down
-
cTDP-down
12W
Peak Power
-
Peak Power
57W
Max Operating Temp
-
Max Operating Temp
110°C Max

-
PCIe
PCIe 4.0 x20
39.4GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
512
Boost Clock
825MHz
Boost Clock
2.05GHz
··
844.8 GFLOPSFP16
··
4.2 TFLOPSFP16

NPU Model
Hexagon
NPU Model
AI Boost 3
NPU Cores
-
NPU Cores
2
Performance
6.5 TOPS
Performance
13 TOPSINT8

Modem Model
X53
Modem Model
-
Cellular
5G mmWave
Cellular
-
Peak Down
Up to 3.7Gbps
Peak Down
-
Peak Up
Up to 2.9Gbps
Peak Up
-

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
KryoARMv8.2-A
Architecture
Family
Family
Branding
Snapdragon 7c Plus Gen 3  branding
Branding
Core Ultra 5 2023 branding
Codename
-
-
Cortex-A78P-Core
-
Cortex-A55E-Core
Codename
Arrow Lake-U
Arrow Lake-U-2P-8EVariant
Redwood CoveP-Core
CrestmontM-Core
CrestmontE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Dec 22, 2021
Release Date
Jul 31, 2025

Foundry
TSMC
Foundry
Intel
Other Foundries
-
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Fabrication Node
N6
-
-
-
Fabrication Node
Intel 3
N5iGPU
N6IO
N6SoC
Die Size
-
Die Size
23mm²iGPU
10mm²IO
100mm²SoC

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